FGA50N100BNTD2 Fairchild Semiconductor, FGA50N100BNTD2 Datasheet

IGBT NPT 1000V 50A TO-3P

FGA50N100BNTD2

Manufacturer Part Number
FGA50N100BNTD2
Description
IGBT NPT 1000V 50A TO-3P
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FGA50N100BNTD2

Igbt Type
NPT and Trench
Voltage - Collector Emitter Breakdown (max)
1000V
Vce(on) (max) @ Vge, Ic
2.9V @ 15V, 60A
Current - Collector (ic) (max)
50A
Power - Max
156W
Input Type
Standard
Mounting Type
Through Hole
Package / Case
TO-3PN-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FGA50N100BNTD2
Manufacturer:
FAIRCHILD
Quantity:
4 000
Company:
Part Number:
FGA50N100BNTD2
Quantity:
3 000
©2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. A
Absolute Maximum Ratings
Notes:
1: Repetitive rating : Pulse width limited by max. junction temperature
Thermal Characteristics
FGA50N100BNTD2
1000V, 50A NPT-Trench IGBT CO-PAK
Features
• High Speed Switching
• Low Saturation Voltage : V
• High Input Impedance
• Built-in Fast Recovery Diode
• RoHS Compliant
Applications
Micro-Wave Oven, I-H Cooker, I-H Jar, Induction Heater, Home
Appliance.
V
V
I
I
I
I
P
T
T
T
R
R
R
C
CM (1)
F
FM
stg
J
L
CES
GES
D
θJC
θJC
θJA
Symbol
Symbol
(IGBT)
(DIODE)
Thermal Resistance, Junction to Case
Collector to Emitter Voltage
Gate to Emitter Voltage
Collector Current
Collector Current
Pulsed Collector Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction Temperature
Storage Temperature Range
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
G C E
CE(sat)
= 2.5 V @ I
Description
TO-3P
Parameter
C
= 60A
@ T
@ T
@ T
@ T
@ T
C
C
C
C
C
1
= 25
= 100
= 100
= 25
= 100
General Description
Trench insulated gate bipolar transistors (IGBTs) with NPT
technology show outstanding performance in conduction and
switching characteristics as well as enhanced avalanche
ruggedness. These devices are well suited for micro-wave,
Induction heating (I-H) Jar, induction heater, home appliance.
o
o
C
C
o
o
o
C
C
C
Typ.
-
-
-
G
-55 to +150
-55 to +150
Ratings
1000
± 25
200
150
156
300
50
35
15
63
Max.
40.0
0.8
1.2
C
E
February 2009
www.fairchildsemi.com
Units
Units
o
o
o
C/W
C/W
C/W
o
o
o
W
W
V
V
A
A
A
A
A
C
C
C
tm

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FGA50N100BNTD2 Summary of contents

Page 1

... R (DIODE) Thermal Resistance, Junction to Case θJC R Thermal Resistance, Junction to Ambient θJA ©2009 Fairchild Semiconductor Corporation FGA50N100BNTD2 Rev. A General Description Trench insulated gate bipolar transistors (IGBTs) with NPT = 2 60A technology show outstanding performance in conduction and C switching characteristics as well as enhanced avalanche ruggedness. These devices are well suited for micro-wave, Induction heating (I-H) Jar, induction heater, home appliance ...

Page 2

... Gate to Emitter Charge ge Q Gate to Collector Charge gc Electrical Characteristics of the Diode V Diode Forward Voltage FM t Diode Reverse Recovery Time rr I Instantaneous Reverse Current R FGA50N100BNTD2 Rev. A Packaging Package Type Qty per Tube TO-3PN Rail / Tube T = 25°C unless otherwise noted C Test Conditions = 0V 1mA GE C ...

Page 3

... 125 C C 120 Collector-Emitter Voltage, V Figure 5. Saturation Voltage vs. Case Temperature at Variant Current Level 4.5 Common Emitter V = 15V GE 3.0 1.5 1 Collector-EmitterCase Temperature, T FGA50N100BNTD2 Rev. A Figure 2. Typical Output Characteristics 200 160 9V 120 [V] CE Figure 4. Transfer Characteristics 200 160 120 [V] CE Figure 6. Saturation Voltage vs. V ...

Page 4

... Figure 9. Capacitance Characteristics 8000 6000 C ies 4000 2000 C C res oes 0 1 Collector-Emitter Voltage, V Figure 11. SOA Characteristics 500 100 10 1 *Notes: 0 150 Single Pulse 0. 100 Collector-Emitter Voltage, V FGA50N100BNTD2 Rev. A Figure 8. Saturation Voltage vs Common Emitter [V] GE Figure 10. Gate charge Characteristics 15 12 Common Emitter 0V 1MHz ...

Page 5

... Collector Current 200 100 Collector Current, I Figure 17. Switching Loss vs. Gate Resistance 50 Common Emitter V = 600V 15V 60A 125 Gate Resistance, R FGA50N100BNTD2 Rev. A Figure 14. Turn-off Characteristics vs. 2000 1000 100 = 600V 15V 60A 125 Ω Figure 16. Turn-off Characteristics vs. 1000 100 d(on) Common Emitter Ω 15V ...

Page 6

... Figure 21. Reverse Current 300 100 125 0.1 0. 1E-3 50 200 400 600 Reverse Voltage, V Figure 23. Reverse Recovery Characteristics vs. Forward Current Forward Current,I FGA50N100BNTD2 Rev. A Figure 20. Forward Characteristics 200 100 10 1 0.1 1000 3000 [V] CE Figure 22. Reverse Recovery Characteristics vs 800 1000 [ µ di/dt = 100A/ ...

Page 7

... Typical Performance Characteristics 1 0.1 0.01 1E-3 1E-5 FGA50N100BNTD2 Rev. A Figure 24.Transient Thermal Impedance of IGBT 0.5 0.2 0.1 0.05 0.02 0.01 single pulse 1E-4 1E-3 0.01 Rectangular Pulse Duration [sec Duty Factor t1/t2 Peak T = Pdm x Zthjc + 0 www.fairchildsemi.com ...

Page 8

... Mechanical Dimensions FGA50N100BNTD2 Rev. A TO-3PN 8 www.fairchildsemi.com ...

Page 9

... Definition of Terms Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production FGA50N100BNTD2 Rev. A ® FRFET Programmable Active Droop™ SM ® Global Power Resource QFET Green FPS™ QS™ Green FPS™ e-Series™ ...

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