FDMC8854 Fairchild Semiconductor, FDMC8854 Datasheet

FDMC8854

Manufacturer Part Number

FDMC8854

Description

MOSFET N-CH 30V 15A POWER33

Manufacturer

Fairchild Semiconductor

Series

PowerTrench®r

Datasheet

1.FDMC8854.pdf (7 pages)

Specifications of FDMC8854

Fet Type

MOSFET N-Channel, Metal Oxide

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

5.7 mOhm @ 15A, 10V

Drain To Source Voltage (vdss)

30V

Current - Continuous Drain (id) @ 25° C

15A

Vgs(th) (max) @ Id

3V @ 250µA

Gate Charge (qg) @ Vgs

57nC @ 10V

Input Capacitance (ciss) @ Vds

3405pF @ 10V

Power - Max

Mounting Type

Surface Mount

Package / Case

8-MLP, Power33

Configuration

Single Quad Drain Triple Source

Transistor Polarity

N-Channel

Resistance Drain-source Rds (on)

0.0057 Ohm @ 10 V

Forward Transconductance Gfs (max / Min)

60 S

Drain-source Breakdown Voltage

30 V

Gate-source Breakdown Voltage

+/- 20 V

Continuous Drain Current

15 A

Power Dissipation

2000 mW

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

FDMC8854TR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

FDMC8854

Manufacturer:

Quantity:

1 350

Company:

Meier Automation Equipment Co., Limited

Part Number:

FDMC8854

Manufacturer:

EXCELLIAN

Quantity:

20 000

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence. This is a preliminary

notification. A Final PCN will be issued when qualification is complete and data is available.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Lam, HH

E-mail: HH.Lam@fairchildsemi.com

Phone: 604 850 2392

Implementation of change:

Expected 1st Device Shipment Date: 2008/02/10

Earliest Year/Work Week of Changed Product: 0812

Change Type Description: Mold Compound

Description of Change (From): FPG 8L MLP3x3 package assembly at all FSC approved

manufacturing location(s) (Carsem) using non Green mold compound as shown in table 1.

Description of Change (To): FPG 8L MLP 3x3 package assembly at all FSC approved

manufacturing location(s) (Carsem) using Green mold compound as shown in table 2.

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance. The referenced material changes have been made

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070296

Qualification :

Qualification of Carsem FPG 8L MLP 3x3 with Green EMC (G600)

Change From

Technical Contact:

Name: Yeoh, LiangChoon

E-mail: Liang.Yeoh@fairchildsemi.com

Phone: 604 850 2744

FORECAST CHANGE NOTIFICATION

Date Issued On : 2007/11/30

Date Created : 2007/11/12

PCN# : Q4074601

Pg. 1

Related parts for FDMC8854

FDMC8854 Summary of contents

Page 1

... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...

Page 2

Change To Qualification Stress Test and Sample Size Detail Device #1 FDM6296 Package: #Leads: Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard HAST2 X JESD22-A110 85%RH, 110C, PRCL MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C ...

Page 3

... ACLV X JESD22-A102 100%RH, 121C 96 HAST2 X JESD22-A110 85%RH, 110C, HTGB JESD22-A108 150C, 20V HTRB JESD22-A108 150C, 176V PRCL MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C Device #3 FDMC8854 Package #Leads: Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV ...

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