FMB3906 Fairchild Semiconductor, FMB3906 Datasheet

FMB3906

Manufacturer Part Number

FMB3906

Description

TRANSISTOR PNP 40V SSOT-6

Manufacturer

Fairchild Semiconductor

Datasheet

1.FMB3906.pdf (6 pages)

Specifications of FMB3906

Transistor Type

2 PNP (Dual)

Current - Collector (ic) (max)

200mA

Voltage - Collector Emitter Breakdown (max)

40V

Vce Saturation (max) @ Ib, Ic

400mV @ 5mA, 50mA

Dc Current Gain (hfe) (min) @ Ic, Vce

100 @ 10mA, 1V

Power - Max

700mW

Frequency - Transition

200MHz

Mounting Type

Surface Mount

Package / Case

6-SSOT, SuperSOT-6

Configuration

Dual

Transistor Polarity

PNP

Mounting Style

SMD/SMT

Collector- Emitter Voltage Vceo Max

40 V

Emitter- Base Voltage Vebo

5 V

Continuous Collector Current

0.2 A

Maximum Dc Collector Current

0.2 A

Power Dissipation

0.7 W

Maximum Operating Frequency

200 MHz

Maximum Operating Temperature

+ 150 C

Dc Collector/base Gain Hfe Min

100

Minimum Operating Temperature

- 55 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Current - Collector Cutoff (max)

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence. This is a preliminary

notification. A Final PCN will be issued when qualification is complete and data is available.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Ursal, Randy

E-mail: Randy.Ursal@notes.fairchildsemi.com

Phone:

Implementation of change:

Expected 1st Device Shipment Date: 2008/01/14

Earliest Year/Work Week of Changed Product: D0803

Change Type Description: Mold Compound

Description of Change (From): SSOT-3 and SSOT-6 package assembly in FSC approved

manufacturing locations using non-Green mold compound as shown in table 1:

Description of Change (To): SSOT-3 and SSOT-6 package assembly at all FSC approved

manufacturing locations using Green mold compound as shown in table 2:

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance. The referenced material changes have been made

to provide a "Full Green" (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070473

Qualification :

Qualification of Green Molding compound for SSOT-3 and SSOT-6.

Change From

Technical Contact:

Name: Uy, Lester

E-mail: Lester.Uy@fairchildsemi.com

Phone: 63-32-3415636

FORECAST CHANGE NOTIFICATION

Date Issued On : 2007/12/07

Date Created : 2007/11/29

PCN# : Q4074811

Pg. 1

Related parts for FMB3906

FMB3906 Summary of contents

Page 1

... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...

Page 2

Change To Pg. 2 ...

Page 3

Qualification Stress Test and Sample Size Detail Device #1 FAN2558SX Package: TTG23 #Leads: 006 Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV X JESD22-A102 100%RH, 121C 96 SOPL1 JESD22-A108 NA%RH, 150C THBT X JESD22-A101 ...

Page 4

Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV X JESD22-A102 100%RH, 121C 96 PRCL MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C Device #3 FDC637BNZ Package: TTK23 006 #Leads: Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment ...

Page 5

Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV X JESD22-A102 100%RH, 121C 96 H3TRB X JESD22-A101B85%RH, 85C, HAST2 X JESD22-A110 85%RH, 110C, HTGB JESD22-A108 150C, 25V HTRB JESD22-A108 150C, 24V PRCL MIL- STD-750-1036 TMCL1 ...

Page 6

... MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C UHAST1 X JESD22-A118 100%RH, 121C 96 Product Id Description : This forecast notification covers Fairchild Semiconductor SSOT-3 & SSOT-6 packages. For complete listing of products covered in this PCN release, please refer to the Affected FSID listing. Affected FSIDs : 0332_B03005A FAN2559S13X FDC2512 ...

Page 7

... FDC6901L FDN302P FDN304PZ FDN304P_NL FDN308P FDN335N FDN336P_NL FDN338P FDN3400 FDN340P_NL FDN352AP FDN357N FDN358P_NL FDN359BN FDN360P_NL FDN361BN FDN5618P FDN5630 FMB100 FMB2227A FMB3906 FMB5551 FMBA14 FMBM5401_SB74001 FMBS5401 FMBSA06 FMMT549 FSB619 FSB660A FSB749 MMBF5434 NDC631N NDC632P_F095 NDC651N_F073 NDC652P_F073 NDC7002N FDC642P_NL FDC645N FDC645N_NL FDC6506P_NL FDC653N_F095 ...

Page 8

NDC7002N_SB9G007 NDS331N_D87Z NDS332P NDS335N NDS336P NDS351AN_NL NDS352AP NDS355AN_NB9L007A NDS356AP PB32_BPB003A SI3442DV_NL SI3454DV_F073 SI3456DV_NF073 SI3457DV_F073 NDC7003P NDS331N_ND87Z NDS332P_F080 NDS335N_D87Z NDS336P_NL NDS351AN_SBNL001 NDS352AP_NL NDS355AN_NL NDS356AP_NB8L005A SI3442DV_F073 SI3443DV SI3455DV_F073 SI3456DV_NL SI3457DV_F095 NDS331N NDS331N_NL NDS332P_NL NDS335N_NL NDS351AN NDS351N NDS355AN NDS355N NDS356AP_NL SI3442DV_NF073 SI3443DV_F095 SI3456DV_F073 ...

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