DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
Name: LEE, SANGDO
Phone: 86-512-6762-3311 ext 8671
Name: Sun, Brian
Implementation of change:
Expected 1st Device Shipment Date: 2008/01/29
Earliest Year/Work Week of Changed Product: 0805
Change Type Description: Lead Frame Dimensions (Internal and External)
Description of Change (From): Current TO-220 heatsink and die attach pad thickness of
Description of Change (To): New TO-220 heatsink and die attach pad thickness will be
0.51mm. There is no change in heatsink and die attach pad material. Conversion of heatsink
thickness will be done on a part by part basis starting WW05 of 2008 to prevent mixing of
product with different heat sink dimensions in shipments during the transition period.
Reason for Change : Enhancement of leadframe design to improve package mechanical
performance and support additional demand for various TO-220 products to improve our
service to customers. There is insignificant difference in product thermal performance.
Qual/REL Plan Numbers : Q20070208
Passed and meet the FSC rel performance requirement
Date Created : 2007/11/16
Date Issued On : 2007/11/29
PCN# : Q3073802-A