PIC16F721-E/ML Microchip Technology, PIC16F721-E/ML Datasheet - Page 157

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PIC16F721-E/ML

Manufacturer Part Number
PIC16F721-E/ML
Description
7 KB FLASH, 256 B SRAM, 18 I/O 20 QFN 4x4mm TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheet

Specifications of PIC16F721-E/ML

Core Processor
PIC
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
17.2.10
When the CKP bit is cleared, the SCL output is held low
once it is sampled low. Therefore, the CKP bit will not
stretch the SCL line until an external I
has already asserted the SCL line low. The SCL output
will remain low until the CKP bit is set and all other
devices on the I
ensures that a write to the CKP bit will not violate the
minimum high time requirement for SCL
FIGURE 17-14:
 2010 Microchip Technology Inc.
SSPCON
SDA
CKP
SCL
WR
CLOCK SYNCHRONIZATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
2
C bus have released SCL. This
CLOCK SYNCHRONIZATION TIMING
DX
2
C master device
(Figure
Master device
asserts clock
17-14).
17.2.11
While in Sleep mode, the I
addresses of data, and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if SSP interrupt is enabled).
Master device
deasserts clock
PIC16F/LF720/721
SLEEP OPERATION
2
C module can receive
DS41430A-page 157
DX-1

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