PIC16F721-E/ML Microchip Technology, PIC16F721-E/ML Datasheet - Page 243

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PIC16F721-E/ML

Manufacturer Part Number
PIC16F721-E/ML
Description
7 KB FLASH, 256 B SRAM, 18 I/O 20 QFN 4x4mm TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheet

Specifications of PIC16F721-E/ML

Core Processor
PIC
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2010 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC16F720
I
E
MV
ML
P
SO
SS
3-Digit Pattern Code for QTP (blank otherwise)
Range
X
= -40C to +85C
= -40C to +125C
= Micro Lead Frame (UQFN)
=
=
=
=
Micro Lead Frame (QFN)
Plastic DIP
SOIC
SSOP
(1)
, PIC16LF720
Package
/XX
(1)
, PIC16F721
Pattern
XXX
(1)
, PIC16LF721
(1)
PIC16F/LF720/721
Examples:
a)
b)
Note 1:
PIC16F720-E/P 301 = Extended Temp., PDIP
package, QTP pattern #301
PIC16F721-I/SO = Industrial Temp., SOIC
package
T
= In tape and reel.
.
DS41430A-page 243

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