S25FL064A0LMFI001 Spansion Inc., S25FL064A0LMFI001 Datasheet - Page 24

S25FL064A0LMFI001

Manufacturer Part Number
S25FL064A0LMFI001
Description
Manufacturer
Spansion Inc.
Datasheet

Specifications of S25FL064A0LMFI001

Cell Type
NOR
Density
64Mb
Access Time (max)
9ns
Interface Type
Serial (SPI)
Boot Type
Not Required
Address Bus
1b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
SOIC W
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
8M
Supply Current
13mA
Mounting
Surface Mount
Pin Count
16
Lead Free Status / RoHS Status
Compliant

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9.10
February 27, 2009 S25FL064A_00_C4
Bulk Erase (BE)
The Bulk Erase (BE) command sets all the bits within the entire memory array to logic 1s. A WREN command
is required prior to writing the PP command.
The host system must drive CS# low, and then write the BE command on SI. CS# must be driven low for the
entire duration of the BE sequence. The command sequence is shown in
on page
The host system must drive CS# high after the device has latched the 8th bit of the CE command, otherwise
the device does not execute the command. The BE operation begins as soon as CS# is driven high. The
device internally controls the timing of the operation, which requires a period of t
be read to check the value of the Write In Progress (WIP) bit while the BE operation is in progress. The WIP
bit is 1 during the BE operation, and is 0 when the operation is completed. The device internally resets the
Write Enable Latch to 0 before the operation completes (the exact timing is not specified).
The device only executes a BE command if all Block Protect bits (BP2:BP0) are 0 (see
on page
28.
13). Otherwise, the device ignores the command.
SO
CS#
SCK
SI
Hi-Z
D a t a
Mode 3
Mode 0
Figure 9.10 Bulk Erase (BE) Command Sequence
S h e e t
S25FL064A
0
1
2
Command
3
4
5
6
Figure 9.10
7
BE
. The Status Register may
and
Table 7.1
Table 9.4
25

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