S25FL064A0LMFI001 Spansion Inc., S25FL064A0LMFI001 Datasheet - Page 26

• Manufacturer Part Number: S25FL064A0LMFI001
• Manufacturer: Spansion Inc.

Specifications of S25FL064A0LMFI001

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 9ns
• Interface Type: Serial (SPI)
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC W
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 8M
• Supply Current: 13mA
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / RoHS Status: Compliant

9.12
February 27, 2009 S25FL064A_00_C4
Release from Deep Power Down (RES)
The device requires the Release from Deep Power Down (RES) command to exit the Deep Power Down
mode. When the device is in the Deep Power Down mode, all commands except RES are ignored.
The host system must drive CS# low and write the RES command to SI. CS# must be driven low for the entire
duration of the sequence. The command sequence is shown in
The host system must drive CS# high t
from DP mode to the standby mode after a delay of t
the device can execute any read or write command.
Figure 9.12 Release from Deep Power Down (RES) Command Sequence
SCK
CS#
SI
SO
Mode 3
Mode 0
Hi-Z
D a t a
S h e e t
0
RES(max)
S25FL064A
1
Deep Power-down Mode
2
after the 8-bit RES command byte. The device transitions
Command
3
RES
4
(see
5
6
Table 16.1 on page
Figure 9.12
7
t
RES
and
Standby Mode
Table 9.4 on page
32). In the standby mode,
28.
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