FSTUD16450MTDX Fairchild Semiconductor, FSTUD16450MTDX Datasheet
FSTUD16450MTDX
Specifications of FSTUD16450MTDX
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FSTUD16450MTDX Summary of contents
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... Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Note 1: BGA package available in Tape and Reel only. UHC® registered trademark of Fairchild Semiconductor Corporation. © 2001 Fairchild Semiconductor Corporation Features ...
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Connection Diagrams Pin Assignment for TSSOP Pin Assignment for FBGA (Top Thru View) www.fairchildsemi.com Pin Descriptions Pin Name Description Bus Switch Enables 1 2 1A, 2A Bus A 1B, 2B Bus Bit Configuration ...
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Logic Diagrams 20-Bit Configuration (Configuration 1) 5-Bit Configuration (Configuration 3) 10-Bit Configuration (Configuration 2) 4-Bit Configuration (Configuration 4) 3 www.fairchildsemi.com ...
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Functional Description The device can also be configured and 16-bit device by grounding the unused pins in Configurations 2 and 1 respectively. The 8-bit configuration may also be achieved by tying two of the 4-bit enables from ...
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Truth Tables (Continued Configuration Inputs ...
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Absolute Maximum Ratings Supply Voltage ( Switch Voltage (V ) (Note Input Control Pin Voltage (V ) (Note Input Diode Current ( Output (I ) ...
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AC Electrical Characteristics Symbol Parameter Propagation Delay Bus-to-Bus PHL PLH (Note Output Enable Time PZH PZL Output Disable Time PHZ PLZ Output ...
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Undershoot Characteristic Symbol Parameter V Output Voltage During Undershoot OUTU Note 11: This test is intended to characterize the device’s protective capabilities by maintaining output signal integrity during an input transient voltage undershoot event. Device Test Conditions Parameter Value V ...
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FIGURE 4. 9 www.fairchildsemi.com ...
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Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide www.fairchildsemi.com Package Number BGA54A Preliminary 10 ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Technology Description The Fairchild Switch family derives from and embodies Fairchild’s proven switch technology used for several years in its 74LVX3L384 ...