FSUSB11MTCX Fairchild Semiconductor, FSUSB11MTCX Datasheet - Page 9

• Manufacturer Part Number: FSUSB11MTCX
• Description: IC USB SWITCH DUAL 1X1 14TSSOP
• Manufacturer: Fairchild Semiconductor
• Type: Analog Switchr

Specifications of FSUSB11MTCX

• Function: USB Switch
• Circuit: 2 x 1:1
• On-state Resistance: 1.5 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 1.65 V ~ 5.5 V
• Current - Supply: 0.5µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Switch Configuration: SPDT
• On Resistance (max): 2.8 Ohms (Typ) @ 2.7 V
• On Time (max): 50 ns
• Off Time (max): 20 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Multiplexer Configuration: Dual SPDT
• Number Of Inputs: 2
• Number Of Outputs: 4
• Number Of Channels: 2
• Analog Switch On Resistance: 4.5@2.7VOhm
• Analog Switch Turn On Time: 50ns
• Analog Switch Turn Off Time: 20ns
• Package Type: TSSOP
• Power Supply Requirement: Single
• Single Supply Voltage (min): 1.65V
• Single Supply Voltage (typ): 3/5V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Mounting: Surface Mount
• Pin Count: 14
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

© 2005 Fairchild Semiconductor Corporation
FSUSB11 • Rev. 1.0.4
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
Figure 14. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
B. DIMENSIONS ARE IN MILLIMETERS
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
E. LANDPATTERN STANDARD: SOP65P640X110-14M
A. CONFORMS TO JEDEC REGISTRATION MO-153,
D. DIMENSIONING AND TOLERANCES PER ANSI
F. DRAWING FILE NAME: MTC14REV6
AND TIE BAR EXTRUSIONS
VARIATION AB, REF NOTE 6
Y14.5M, 1982
0.43 TYP
9
0.65
R0.09 min
0.45
1.65
1.00
R0.09min
12.00°
TOP & BOTTOM
6.10
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