LH28F008SAHT-T9 Sharp Electronics, LH28F008SAHT-T9 Datasheet

LH28F008SAHT-T9

Manufacturer Part Number
LH28F008SAHT-T9
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of LH28F008SAHT-T9

Cell Type
NOR
Density
8Mb
Access Time (max)
90ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
20b
Operating Supply Voltage (typ)
5V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
11.4 to 12.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Word Size
8b
Number Of Words
1M
Supply Current
50mA
Mounting
Surface Mount
Pin Count
40
Lead Free Status / Rohs Status
Compliant
P
P
S
RELIMINARY
RODUCT
PECIFICATION
Integrated Circuits Group
LH28F008SAHT-T9
Flash Memory
8Mbit (1Mbitx8)
(Model Number: LHF08ST9)
Lead-free (Pb-free)
Spec. Issue Date: October 5, 2004
Spec No: EL16X022

Related parts for LH28F008SAHT-T9

LH28F008SAHT-T9 Summary of contents

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... RELIMINARY RODUCT PECIFICATION LH28F008SAHT-T9 Flash Memory 8Mbit (1Mbitx8) (Model Number: LHF08ST9) Spec. Issue Date: October 5, 2004 Lead-free (Pb-free) Spec No: EL16X022 Integrated Circuits Group ...

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Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. ●When using the products covered herein, please observe ...

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FEATURES 2 PRODUCT OVERVIEW 3 PRINCIPLES OF OPERATION 4 BUS OPERATION 5 COMMAND DEFINITIONS 6 EXTENDED BLOCK ERASE/BYTE WRITE CYCLING ························ 7 AUTOMATED BYTE WRITE 8 AUTOMATED BLOCK ERASE 9 DESIGN CONSIDERATIONS 10 ABSOLUTE MAXIMUM RATINGS 11 OPERATING CONDITIONS ...

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... The LH28F008SAHT-T9 is offered in 40-lead TSOP (standard) package. Pin assignments simplify board layout when integrating multiple devices in a flash memory array or subsystem. This device uses an integrated Command User Interface and state machine for simplified block erasure and byte write. The LH28F008SAHT-T9 memory map consists of 16 sepa- rately erasable 64K-byte blocks. ...

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... Erase Suspend mode allows system software to suspend block erase to read data or execute code from any other block of the LH28F008SAHT-T9. The LH28F008SAHT-T9 is available in the 40-lead TSOP (Thin Small Outline Package, 1.2mm thick) package. Pinouts are shown in Figure 2 of this specification. The Command User Interface serves as the interface be- tween the microprocessor or microcontroller and the inter- nal operation of the LH28F008SAHT-T9 ...

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LHF08ST9 REGISTER DATA MULTIPLEXER OUTPUT Figure 1. Block Diagram 4 ...

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Symbol Type ADDRESS INPUTS: for memory addresses. Addresses are internally A -A INPUT 0 19 latched during a write cycle. DATA INPUT/OUTPUTS: Inputs data and commands during Command User Interface write cycles; outputs data during memory array, Status DQ -DQ ...

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CE RP ...

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0- 21-22 17-20 LATCH SBHE# SBHE# PSTART# PCMD# 80386SL 80386SL µPLD PM/IO# PW/R# FLSHDCS# PRDY# VGACS# CTRL SD 0-15 XCVR INT RY/BY# 82360SL # RESET Controller POWERGOOD EPLD(s) Figure 3. LH28F008SA Array Interface ...

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... Interface software to initiate and poll progress of internal byte write and block erase can be stored in any of the LH28F008SAHT-T9 blocks. This code is copied to, and ex- ecuted from, system RAM during actual flash memory up- date. After successful completion of byte write and/or block erase, code/data reads from the LH28F008SAHT-T9 are again possible via the Read Array command ...

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... Status Register). The LH28F008SAHT-T9 au- tomatically resets to Read Array mode upon initial device powerup or after exit from deep powerdown. The LH28F008SAHT-T9 has four control pins, two of which must be logically active to obtain data at the outputs. Chip Enable (CE#) is the device selection control, and when active enables the selected memory device ...

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... Deep Power-Down The LH28F008SAHT-T9 offers a deep powerdown feature, entered when RP Current draw thru V IL maximum in deep powerdown mode, with current draw through V maximal 5µA. During read modes, RP#-low PP deselects the memory, places output drivers in a high- impedence state and turns off all internal circuits. The ...

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... The Read Array command is functional when V PP Intelligent Identifier Command The LH28F008SAHT-T9 contains an intelligent identifier operation, initiated by writing 90H into the Command User Interface. Following the command write, a read cycle from address 00000H retrieves the manufacturer code of 89H. A read cycle from address 00001H returns the device code of A2H ...

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... The Erase Suspend Status and WSM Status bits of the Status Register will be automatically cleared and RY/BY# will return to V sume command is written to it, the LH28F008SAHT-T9 au- tomatically outputs Status Register data when read (see Figure 7; Erase Suspend/Resume Flowchart). V ...

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... Figure 5 shows a system software flowchart for device byte write. The entire sequence is performed with V (1) Assumptions: 10K-byte file written every 10 minutes. (20M-byte array)/(10K-byte file) = 2,000 file writes before erase required. (2000 files writes/erase) x (100,000 cycles per LH28F008SAHT-T9 block) = 200 million file writes. 6 (200 x 10 file writes) x (10 min/write hr/60 min ...

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... Byte Write Successful Figure 5. Automated Byte Write Flowchart LHF08ST9 RY/BY# can be connected to the interrupt input of the sys- tem CPU or controller active at all times, not tristated if the LH28F008SAHT-T9 CE# or OE# inputs are brought RY/BY# is also V when the device is in Erase Sus pend or deep powerdown modes. ...

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Start Write 20H, Block Address Write D0H Block Address NO Erase Suspend WSM NO Suspend Ready? Erase? YES YES Full Status Check if Desired Block Erase Completed FULL STATUS CHECK PROCEDURE Status Register Data Read (See Above) V Range NO ...

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... SB V Trace on Printed Circuit Boards PP Writing flash memories, while they reside in the target sys- tem, requires that the printed circuit board designer pay at- tention to the V power supply trace. The V PP the memory cell current for writing and erasing. Use similar and GND ...

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... Flash nonvolatility increases usable battery life, because the LH28F008SAHT-T9 does not consume any power to re- or CE# PP tain code or data when the system is off. ...

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ABSOLUTE MAXIMUM RATINGS* Operating Temperature During Read .........................................-40˚C to +85˚C During Block Erase/Byte Write ................-40˚C to +85˚C Temperature Under Bias .....................-40˚C to +85˚C Storage Temperature ........................-65˚C to +125˚C Voltage on Any Pin (except V and ...

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DC CHARACTERISTICS (Continued) Symbol Parameter I V Byte Write Current CCW Block Erase Current CCE Erase Suspend Current CCES Standby Current PPS Deep PowerDown PPD PP Current I ...

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AC INPUT/OUTPUT REFERENCE WAVEFORM (1) 2.4 2.0 INPUT TEST POINTS 0.8 0.45 AC test inputs are driven at V (2.4V OH TTL (0.45V ) for a Logic "0". Input timing begins at V TTL (0.8V ). Output timing ends at ...

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LHF08ST9 Figure 8. AC Waveform for Read Operations 21 ...

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... IN 5. The on-chip Write State Machine incorporates all byte write and block erase system functions and overhead of standard SHARP flash memory, including byte program and verify (byte write) and block precondition, precondition verify, erase and erase verify (block erase). 6. Byte write and block erase durations are measure to completion (SR.7=1, RY/ BY#=V nation of byte write/block erase success (SR ...

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BLOCK ERASE AND BYTE WRITE PERFORMANCE Parameter Notes Block Erase Time Block Write Time Byte Write Time NOTES =+25˚C, 12. Excludes System-Level Overhead. AC CHARACTERISTICS - Reset Operation V OH RY/BY#(R) V ...

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LHF08ST9 Figure 9. AC Waveform for Write Operations 24 ...

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ALTERNATIVE CE#-CONTROLLED WRITES Versions Symbol Parameter t t Write Cycle Time AVAV RP# High Recovery to PHEL PS CE# Going Low t t WE# Setup to CE# Going WLEL WS Low t t CE# Pulse Width ...

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LHF08ST9 Figure 10. AC Waveform for Write Operations 26 ...

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A-1 RECOMMENDED OPERATING CONDITIONS A-1.1 At Device Power-Up AC timing illustrated in Figure A-1 is recommended for the supply voltages and the control signals at device power-up. If the timing in the figure is ignored, the device may not operate ...

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A-1.1.1 Rise and Fall Time Symbol t V Rise Time Input Signal Rise Time R t Input Signal Fall Time F NOTES: 1. Sampled, not 100% tested. 2. This specification is applied for not only the device ...

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A-1.2 Glitch Noises Do not input the glitch noises which are below V as shown in Figure A-2 (b). The acceptable glitch noises are illustrated in Figure A-2 (a). Input Signal V (Min (Max.) IL Input Signal (a) ...

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... A-2 RELATED DOCUMENT INFORMATION Document No. AP-001-SD-E Flash Memory Family Software Drivers AP-006-PT-E Data Protection Method of SHARP Flash Memory RP#, V AP-007-SW-E NOTE: 1. International customers should contact their local SHARP or distribution sales office. (1) Document Name Electric Potential Switching Circuit PP iv Rev. 1.10 ...

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... Head Office: No. 360, Bashen Road, Xin Development Bldg. 22 Waigaoqiao Free Trade Zone Shanghai 200131 P.R. China Email: smc@china.global.sharp.co.jp EUROPE SHARP Microelectronics Europe Division of Sharp Electronics (Europe) GmbH Sonninstrasse 3 20097 Hamburg, Germany Phone: (49) 40-2376-2286 Fax: (49) 40-2376-2232 www.sharpsme.com SINGAPORE SHARP Electronics (Singapore) PTE., Ltd. ...

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