ISL5416KI Intersil, ISL5416KI Datasheet - Page 71

• Manufacturer Part Number: ISL5416KI
• Description: Up/Down Conv Mixer 1.8V 256-Pin BGA
• Manufacturer: Intersil

Specifications of ISL5416KI

• Package: 256BGA
• Operating Supply Voltage: 1.8 V

Plastic Ball Grid Array Packages (BGA)
o
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notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
CORNER I.D.
CORNER
0.006
0.003
0.15
0.08
A
C
S
M
M
A1
A
b
A1
C
C
A B
A1
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
A2
16
15
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
14
13
For information regarding Intersil Corporation and its products, see www.intersil.com
BOTTOM VIEW
12 1110 9
S
SIDE VIEW
TOP VIEW
A
71
D1
D
8
7 6 5
ALL ROWS AND COLUMNS
4
SEATING PLANE
3
2
1
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
e
E
E1
B
bbb
A1
CORNER I.D.
A1
CORNER
aaa
C
C
ISL5416
V256.17x17
256 BALL PLASTIC BALL GRID ARRAY PACKAGE
NOTES:
SYMBOL
1. Controlling dimension: MILLIMETER. Converted inch
2. Dimensioning and tolerancing conform to AMSE Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D” and
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spherical
6. Dimension “A” includes standoff height “A1”, package body thick-
7. Dimension “b” is measured at the maximum ball diameter, paral-
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines the
MD/ME
D1/E1
ααα
D/E
bbb
A1
A2
dimensions are not necessarily exact.
“E” dimensions, respectively.
crowns of the contact balls.
ness and lid or cap height “A2”.
lel to the primary datum C.
position of the solder balls nearest to package centerlines. When
there is an even number of balls in the outer row the value is
“S” = e/2.
A
N
b
e
0.012
0.037
0.587
0.016
0.665
MIN
-
0.039 BSC
INCHES
16 x 16
0.004
0.005
256
0.059
0.016
0.044
0.020
0.673
0.595
MAX
16.90
14.90
0.31
0.95
0.41
MILLIMETERS
MIN
-
1.0 BSC
16 x 16
0.10
0.12
256
15.10
17.10
1.50
0.41
1.13
0.51
MAX
Rev. 2 01/03
NOTES
7
3
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