TDA1517ATW/N1,112 NXP Semiconductors, TDA1517ATW/N1,112 Datasheet - Page 10

• Manufacturer Part Number: TDA1517ATW/N1,112
• Description: IC AMP AUDIO PWR 8W STER 20TSSOP
• Manufacturer: NXP Semiconductors
• Type: Class Br

Specifications of TDA1517ATW/N1,112

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 20-TSSOP Exposed Pad, 20-eTSSOP, 20-HTSSOP
• Max Output Power X Channels @ Load: 8W x 1 @ 8 Ohm; 4W x 2 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 8 W
• Available Set Gain: 26 dB
• Thd Plus Noise: 0.03 %
• Operating Supply Voltage: 12 V
• Supply Current: 40 mA
• Maximum Power Dissipation: 5 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 6 V
• Operational Class: Class-AB
• Output Power (typ): 8x1@8Ohm/4x2@4OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.03@8Ohm@1W%
• Single Supply Voltage (typ): 12V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 5W
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 6V
• Single Supply Voltage (max): 18V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3500-5; 935268373112; TDA1517ATWDH

NXP Semiconductors
Thermal behaviour (PCB design considerations)
The typical thermal resistance [R
HTSSOP20 package is 37 K/W if the IC is soldered on a
printed-circuit board with double sided 35 μm copper with
a minimum area of approximately 30 cm
usable thermal resistance depends strongly on the
mounting method of the device on the printed-circuit
board, the soldering method and the area and thickness of
the copper on the printed-circuit board.
The bottom ‘heat-spreader’ of the IC has to be soldered
efficiently on the ‘thermal land’ of the copper area of the
printed-circuit board using the re-flow solder technique.
A number of thermal vias in the ‘thermal land’ provide a
thermal path to the opposite copper site of the
printed-circuit board. The size of the surface layers should
be as large as needed to dissipate the heat.
2001 Apr 17
handbook, full pagewidth
8 W BTL or 2 × 4 W SE power amplifier
R
L = 30 mm plus vias
th(j-p)
curve is given for practical calculation purpose.
Fig.5 Thermal resistance of the HTSSOP20 mounted on printed-circuit board.
K/W
60
50
40
30
20
10
0
0
th(j-a)
] of the IC in the
2
. The actual
1
number of 35 μm copper layers
2
R th(j-a)
R th(j-p)
10
3
The thermal vias (0.3 mm ∅) in the ‘thermal land’ should
not use web construction techniques, because those will
have high thermal resistance; continuous connection
completely around the via-hole is recommended.
For a maximum ambient temperature of 60 °C the
following calculation can be made: for the application at
V
dissipation approximately 2.0 W;
T
Note: the above calculation holds for application at
‘average listening level’ music output signals. Applying (or
testing) with sine wave signals will produce approximately
twice the music power dissipation; at worst case condition
this can activate the maximum temperature protection.
j(max)
P
= 12 V and R
= T
4
amb
ON-BOARD-COOLING
+ P × R
COPPER DESIGN
L
CU-LAYER 2-4
CU-LAYER 1
= 8 Ω the (ALL-) music power
th(j-a)
MGU306
L
= 60 °C + 2.0 × 37 = 134 °C.
L
TDA1517ATW
Product specification