AD8331ARQ-REEL Analog Devices Inc, AD8331ARQ-REEL Datasheet - Page 55

• Manufacturer Part Number: AD8331ARQ-REEL
• Description: IC VGA SINGLE W/PREAMP 20-SSOP
• Manufacturer: Analog Devices Inc
• Series: X-AMP®r
• Type: Variable Gain Amplifierr

Specifications of AD8331ARQ-REEL

• Rohs Status: RoHS non-compliant
• Design Resources: Interfacing the High Frequency AD8331 to AD9215 (CN0096)
• Applications: Signal Processing
• Mounting Type: Surface Mount
• Package / Case: 20-QSOP
• For Use With: AD8331-EVALZ - BOARD EVAL FOR AD8331

ORDERING GUIDE
Model
AD8331ARQ
AD8331ARQ-REEL
AD8331ARQ-REEL7
AD8331ARQZ
AD8331ARQZ-RL
AD8331ARQZ-R7
AD8331-EVALZ
AD8332ACP-R2
AD8332ACP-REEL
AD8332ACP-REEL7
AD8332ACPZ-R2
AD8332ACPZ-R7
AD8332ACPZ-RL
AD8332ARU
AD8332ARU-REEL
AD8332ARU-REEL7
AD8332ARUZ
AD8332ARUZ-R7
AD8332ARUZ-RL
AD8332-EVALZ
AD8334ACPZ
AD8334ACPZ-REEL
AD8334ACPZ-REEL7
AD8334-EVALZ
1
Z = RoHS Compliant Part.
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
Package Description
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
Evaluation Board with AD8331ARQ
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
Evaluation Board with AD8332ARU
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board with AD8334ACP
Rev. G | Page 55 of 56
AD8331/AD8332/AD8334
Package Option
RQ-20
RQ-20
RQ-20
RQ-20
RQ-20
RQ-20
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
CP-64-1
CP-64-1
CP-64-1