ADP5589 Analog Devices, ADP5589 Datasheet - Page 48

• Manufacturer Part Number: ADP5589
• Description: Keypad Decoder and I/O Expansion
• Manufacturer: Analog Devices

Specifications of ADP5589

• Vin Range: 1.8 to 3.0V
• Number Of I/os: 19
• Application: Mobil I-0 Exp-Keybd Cont,Mobil I-O Expander
• Qwerty Keypad: Yes
• Other Functions: I2C I/O & register
• Function Flag: Mobil I-O
• Package: 24-Lead LFCSP,25-Ball WLCSP

ADP5589
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADP5589ACPZ-00-R7
ADP5589ACPZ-01-R7
ADP5589ACPZ-02-R7
ADP5589ACBZ-00-R7
ADP5589ACBZ-01-R7
ADP5589ACBZ-02-R7
ADP5589CP-EVALZ
1
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
I
registered trademarks are the property of their respective owners.
2
Z = RoHS Compliant Part.
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
1
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
INDICATOR
SEATING
PLANE
IDENTIFIER
SEATING
0.560
0.500
0.440
0.80
0.75
0.70
PIN 1
PLANE
BALL 1
D09714-0-8/11(A)
Figure 32. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Figure 33. 25-Ball Wafer Level Chip Scale Package [WLCSP]
(BALL SIDE DOWN)
TOP VIEW
COMPLIANT TO JEDEC STANDARDS MO-220-WFFE.
3.60
3.50 SQ
3.40
SIDE VIEW
TOP VIEW
Package Description
24-Lead Lead Frame Chip Scale Package[LFCSP_WQ]
24-Lead Lead Frame Chip Scale Package[LFCSP_WQ]
24-Lead Lead Frame Chip Scale Package[LFCSP_WQ]
25-Ball Wafer Level Chip Scale Package[WLCSP]
25-Ball Wafer Level Chip Scale Package[WLCSP]
25-Ball Wafer Level Chip Scale Package[WLCSP]
Evaluation Board
2.030
1.990 SQ
1.950
3.5 mm × 3.5 mm Body, Very Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
0.300
0.260
0.220
Rev. A | Page 48 of 48
0.203 REF
(CP-24-11)
0.50
0.40
0.30
(CB-25-5)
BSC
0.40
0.05 MAX
0.02 NOM
COPLANARITY
COPLANARITY
0.05
0.230
0.200
0.170
0.40
REF
1.60
REF
0.08
18
13
0.25
0.20
0.15
12
19
BOTTOM VIEW
EXPOSED
PAD
5
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
(BALL SIDE UP)
4
24
7
3
1
6
2
0.20 MIN
1
2.30
2.20 SQ
2.10
B
C
D
E
A
Package Option
CP-24-11
CP-24-11
CP-24-11
CB-25-5
CB-25-5
CB-25-5