BAS29_31_35 NXP Semiconductors, BAS29_31_35 Datasheet - Page 5

General purpose switching diodes fabricated in planartechnology, and encapsulated in small rectangular plasticSMD SOT23 packages

BAS29_31_35

Manufacturer Part Number
BAS29_31_35
Description
General purpose switching diodes fabricated in planartechnology, and encapsulated in small rectangular plasticSMD SOT23 packages
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
GRAPHICAL DATA
2003 Mar 20
handbook, halfpage
handbook, full pagewidth
General purpose controlled avalanche
(double) diodes
Device mounted on an FR4 printed-circuit board.
(1) Single diode loaded.
(2) Double diode loaded.
Fig.2
Based on square wave currents.
T
j
I FSM
(mA)
= 25 °C prior to surge.
(A)
I F
10
300
200
100
10
10
−1
0
1
2
0
1
Maximum permissible continuous forward
current as a function of ambient
temperature.
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
(1)
(2)
100
10
T amb (
o
C)
MBG440
200
10
5
2
handbook, halfpage
(1) T
(2) T
(3) T
Fig.3
(mA)
IF
600
400
200
j
j
j
0
= 150 °C; typical values.
= 25 °C; typical values.
= 25 °C; maximum values.
0
Forward current as a function of forward
voltage.
BAS29; BAS31; BAS35
(1)
10
3
(2)
1
(3)
t p (µs)
V F (V)
Product data sheet
MBH280
MBH327
10
2
4

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