TDA8262HN/C1,118 NXP Semiconductors, TDA8262HN/C1,118 Datasheet - Page 27

• Manufacturer Part Number: TDA8262HN/C1,118
• Description: IC SATELLITE TUNER 32-HVQFN
• Manufacturer: NXP Semiconductors
• Type: Satellite Tunerr

Specifications of TDA8262HN/C1,118

• Package / Case: *
• Applications: Demodulation
• Mounting Type: Surface Mount
• Bus Type: I2C
• Maximum Agc: 60 dB (Typ)
• Maximum Frequency: 2175 MHz
• Minimum Frequency: 950 MHz
• Modulation Technique: QPSK
• Mounting Style: SMD/SMT
• Function: Satellite
• Noise Figure: 7.7 dB
• Operating Supply Voltage: 3.3 V
• Supply Voltage (min): 3.15 V
• Supply Voltage (max): 3.45 V
• Minimum Operating Temperature: - 20 C
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935275321118; TDA8262HN/C1-T; TDA8262HN/C1-T

Philips Semiconductors
9397 750 13194
Product data sheet
19.4 Manual soldering
19.5 Package related soldering information
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C
or 265 C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 C and 320 C.
Table 40:
[1]
Package
BGA, HTSSON..T
SSOP..T
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
•
•
•
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[5]
parallel to the transport direction of the printed-circuit board;
transport direction of the printed-circuit board.
, SO, SOJ
[3]
[1]
, TFBGA, VFBGA, XSON
Suitability of surface mount IC packages for wave and reflow soldering methods
[8]
, PMFP
[3]
, LBGA, LFBGA, SQFP,
Rev. 01 — 14 December 2004
[9]
, WQCCN..L
[8]
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
[4]
Fully integrated satellite tuner
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[5] [6]
[7]
TDA8262HN
Reflow
suitable
suitable
suitable
suitable
suitable
not suitable
[2]
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