TDA8262HN/C1,118 NXP Semiconductors, TDA8262HN/C1,118 Datasheet - Page 28

• Manufacturer Part Number: TDA8262HN/C1,118
• Description: IC SATELLITE TUNER 32-HVQFN
• Manufacturer: NXP Semiconductors
• Type: Satellite Tunerr

Specifications of TDA8262HN/C1,118

• Package / Case: *
• Applications: Demodulation
• Mounting Type: Surface Mount
• Bus Type: I2C
• Maximum Agc: 60 dB (Typ)
• Maximum Frequency: 2175 MHz
• Minimum Frequency: 950 MHz
• Modulation Technique: QPSK
• Mounting Style: SMD/SMT
• Function: Satellite
• Noise Figure: 7.7 dB
• Operating Supply Voltage: 3.3 V
• Supply Voltage (min): 3.15 V
• Supply Voltage (max): 3.45 V
• Minimum Operating Temperature: - 20 C
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935275321118; TDA8262HN/C1-T; TDA8262HN/C1-T

Philips Semiconductors
20. Revision history
Table 41:
9397 750 13194
Product data sheet
Document ID
TDA8262HN_1
Revision history
Release date
20041214
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All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods .
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Data sheet status
Product data sheet
Rev. 01 — 14 December 2004
10 C measured in the atmosphere of the reflow oven. The package
Change notice
Doc. number
9397 750 13194
Fully integrated satellite tuner
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
TDA8262HN
Supersedes
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