FPF1039 Fairchild Semiconductor, FPF1039 Datasheet - Page 12

• Manufacturer Part Number: FPF1039
• Manufacturer: Fairchild Semiconductor

© 2010 Fairchild Semiconductor Corporation
FPF1038 / FPF1039 • Rev. 1.0.3
Physical Dimensions
Product-Specific Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
FPF1038UCX
FPF1039UCX
INDEX AREA
Product
2X
BALL A1
1.00
0.03 C
0.05 C
Figure 39.
BOTTOM VIEW
0.50
0.50
C
TOP VIEW
1 2
E
1.5mm+/-0.03
6 Ball, 1.0 x 1.5mm Wafer-Level Chip-Scale Packaging (WLCSP)
C
B
A
SEATING PLANE
(X) ±0.018
A
0.625
0.539
Ø0.315 +/- .025
6X
D
B
D
(Y) ±0.018
2X
0.06 C
F
0.005
0.03 C
E
F
C A B
D
SIDE VIEWS
1.0mm+/-0.03
NOTES:
E
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
D. DATUM C IS DEFINED BY THE SPHERICAL
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
F. FOR DIMENSIONS D, E, X, AND Y SEE
G. DRAWING FILNAME: MKT-UC006AFrev2.
A. NO JEDEC REGISTRATION APPLIES.
SOLDER MASK
±43 MICRONS (539-625 MICRONS).
PER ASMEY14.5M, 1994.
CROWNS OF THE BALLS.
OPENING
PRODUCT DATASHEET.
(Ø0.350)
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
A1
0.240mm
X
(0.50)
0.332±0.018
(1.00)
0.250±0.025
(Ø0.250)
Cu Pad
0.240mm
www.fairchildsemi.com
Y