NC7WZ07L6X Fairchild Semiconductor, NC7WZ07L6X Datasheet - Page 8

• Manufacturer Part Number: NC7WZ07L6X
• Description: IC BUFF DL UHS O/DRAIN 6MICROPAK
• Manufacturer: Fairchild Semiconductor
• Series: 7WZr

Specifications of NC7WZ07L6X

• Logic Type: Buffer/Line Driver, Non-Inverting with Open Drain
• Number Of Elements: 2
• Number Of Bits Per Element: 2
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-MicroPak™
• Logic Family: NC7WZ
• Number Of Channels Per Chip: Dual
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: 85 C
• Mounting Style: SMD/SMT
• Input Bias Current (max): 1 uA
• Low Level Output Current: 32 mA
• Maximum Power Dissipation: 180 mW
• Minimum Operating Temperature: - 40 C
• Output Type: Open Drain
• Number Of Lines (input / Output): 2 / 2
• Propagation Delay Time: 11.5 ns at 1.65 V, 9.5 ns at 1.8 V, 5.8 ns at 2.5 V, 4.4 ns at 3.3 V, 3.5 ns at 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

© 2000 Fairchild Semiconductor Corporation
NC7WZ07 • Rev. 1.0.6
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specification
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf.
Package Designator
FHX
5X
DETAIL A
PIN 1
MIN 250uM
(0.08) 4X
2X
A. COMPLIES TO JEDEC MO-252 STANDARD
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
D. LANDPATTERN RECOMMENDATION IS BASED ON FSC
E. DRAWING FILENAME AND REVISION: MGF06AREV3
NOTES:
0.35
0.25
DESIGN.
0.05 C
C
0.35
Figure 10.
1
6
BOTTOM VIEW
TOP VIEW
SIDE VIEW
Leader (Start End)
Trailer (Hub End)
Tape Section
1.00
2
5
Carrier
6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch
3
4
0.60
0.55MAX
B
(0.08)
4X
0.09
0.19
1.00
A
0.05 C
2X
6X
Cavity Number
0.10
.05 C
125 (Typical)
75 (Typical)
8
0.05 C
5000
C B A
5X
1X
5X 0.40
CHAMFER
1X 0.45
0.075X45°
0.52
0.57
RECOMMENDED LAND PATTERN
FOR SPACE CONSTRAINED PCB
ALTERNATIVE LAND PATTERN
FOR UNIVERSAL APPLICATION
Cavity Status Cover Type Status
(0.05) 6X
DETAIL A
PIN 1 LEAD SCALE: 2X
Empty
Empty
Filled
0.90
0.20 6X
0.89
6X 0.19
0.35
0.35
0.73
0.66
0.40
0.30
Sealed
Sealed
Sealed
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