MM74HC125SJX Fairchild Semiconductor, MM74HC125SJX Datasheet - Page 6

IC BUFF TRI-ST QD N-INV 14SOP

MM74HC125SJX

Manufacturer Part Number
MM74HC125SJX
Description
IC BUFF TRI-ST QD N-INV 14SOP
Manufacturer
Fairchild Semiconductor
Series
74HCr
Datasheet

Specifications of MM74HC125SJX

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
4
Number Of Bits Per Element
1
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (5.3mm Width), 14-SOP, 14-SOIJ
Logic Family
HC
Number Of Channels Per Chip
4
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 7.8 mA
Low Level Output Current
7.8 mA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
4 / 1
Output Type
3-State
Propagation Delay Time
130 ns at 2 V, 26 ns at 4.5 V, 22 ns at 6 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
©1983 Fairchild Semiconductor Corporation
MM74HC125, MM74HC126 Rev. 1.3.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
INDICATOR
PIN ONE
Figure 1. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
1.75 MAX
0.90
0.50
R0.10
(1.04)
R0.10
6.00
1.50
1.25
14
1
(0.33)
1.27
DETAIL A
SCALE: 20:1
8.75
8.50
7.62
0.50
0.25
SEATING PLANE
X 45°
GAGE PLANE
0.35
0.51
0.36
8
7
0.25
0.25
0.10
M
A
3.80
4.00
C
6
NOTES: UNLESS OTHERWISE SPECIFIED
B
0.10
A) THIS PACKAGE CONFORMS TO JEDEC
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
D) LANDPATTERN STANDARD:
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
B
C
1.70
A
SOIC127P600X145-14M
MS-012, VARIATION AB, ISSUE C,
FLASH OR BURRS.
C
LAND PATTERN RECOMMENDATION
SEE DETAIL A
1.27
0.65
5.60
0.25
0.19
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