DIM800DDM17-A000 Dynex Semiconductor, DIM800DDM17-A000 Datasheet - Page 3

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DIM800DDM17-A000

Manufacturer Part Number
DIM800DDM17-A000
Description
Dual Switch Igbt Module
Manufacturer
Dynex Semiconductor
Datasheet
THERMAL AND MECHANICAL RATINGS
Internal insulation material:
Baseplate material:
Creepage distance:
Clearance:
CTI (Critical Tracking Index): 175
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
Symbol
R
R
R
T
th(c-h)
th(j-c)
th(j-c)
T
-
stg
j
Thermal resistance - transistor (per arm)
Thermal resistance - diode (per arm)
Thermal resistance - case to heatsink
(per module)
Junction temperature
Storage temperature range
Screw torque
AlN
AlSiC
20mm
10mm
Parameter
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
Mounting - M6
Electrical connections - M4
Electrical connections - M8
Test Conditions
-
DIM800DDM17-A000
Min.
–40
-
-
-
-
-
-
-
-
Typ.
-
-
-
-
-
-
-
-
-
Max.
150
125
125
18
40
10
8
5
2
˚C/kW
˚C/kW
˚C/kW
Units
Nm
Nm
Nm
˚C
˚C
˚C
3/10

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