UPD753012GC NEC, UPD753012GC Datasheet - Page 70

• Manufacturer Part Number: UPD753012GC
• Description: 4-BIT SINGLE-CHIP MICROCONTROLLER
• Manufacturer: NEC

14. RECOMMENDED SOLDERING CONDITIONS
Device Mounting Technology Manual (C10535E).
Caution Do not use two or more soldering methods in combination (except partial heating).
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Infrared reflow
VPS
Wave soldering
Partial heating
Solder the PD753017 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document Semiconductor
For the soldering methods and conditions other than those recommended, consult NEC.
(1)
Soldering Method
PD753012GC-XXX-3B9: 80-pin plastic QFP (14
PD753016GC-XXX-3B9: 80-pin plastic QFP (14
PD753017GC-XXX-3B9: 80-pin plastic QFP (14
Package peak temperature: 235 ˚C, Time: 30 seconds max. (210 ˚C min.),
Number of times: 3 max.
Package peak temperature: 215 ˚C, Time: 40 seconds max. (200 ˚C min.),
Number of times: 3 max.
Solder bath temperature: 260 ˚C max., Time: 10 seconds max.,
Number of times: 1
Preheating temperature: 120 ˚C max. (package surface temperature)
Pin temperature: 300 ˚C max., Time: 3 seconds max. (per side of device)
Table 14-1. Soldering Conditions of Surface Mount Type
Soldering Conditions
14 mm)
14 mm)
14 mm)
PD753012, 753016, 753017
IR35-00-3
VP15-00-3
WS60-00-1
Recommended
Symbol of
Condition
–