UPD753012GC NEC, UPD753012GC Datasheet - Page 71

• Manufacturer Part Number: UPD753012GC
• Description: 4-BIT SINGLE-CHIP MICROCONTROLLER
• Manufacturer: NEC

Note The number of days for storage after the dry pack has been opened.
Caution Do not use two or more soldering methods in combination (except partial heating).
Infrared reflow
VPS
Pin partial heating
(2)
Soldering Method
25 ˚C, 65% RH max.
PD753012GK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
PD753016GK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
PD753017GK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
Package peak temperature: 235 ˚C, Time: 30 seconds max. (210 ˚C min.),
Number of times: 2 max., Number of days: 7
is necessary at 125 ˚C for 10 hours.)
<Precaution>
Products other than those packed in heat-resistant trays (such as those
packed in a magazine, taping, or non-heat-resistant tray) cannot be baked
while they are in their packaging.
Package peak temperature: 215 ˚C, Time: 40 seconds max. (200 ˚C min.),
Number of times: 2 max., Number of days: 7
is necessary at 125 ˚C for 10 hours.)
<Precaution>
Products other than those packed in heat-resistant trays (such as those
packed in a magazine, taping, or non-heat-resistant tray) cannot be baked
while they are in their packaging.
Pin temperature: 300 ˚C max., Time: 3 seconds max. (per side of device)
Soldering Conditions
Note
Note
(After that, prebaking
(After that, prebaking
PD753012, 753016, 753017
12 mm)
12 mm)
12 mm)
The storing conditions are
IR35-107-2
VP15-107-2
Recommended
Symbol of
Condition
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