FQB9N50CF Fairchild Semiconductor, FQB9N50CF Datasheet

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FQB9N50CF

Manufacturer Part Number
FQB9N50CF
Description
N-Channel MOSFET
Manufacturer
Fairchild Semiconductor
Datasheet
©2006 Fairchild Semiconductor Corporation
FQB9N50CF Rev. A
FQB9N50CF
500V N-Channel MOSFET
Features
• 9A, 500V, R
• Low gate charge ( typical 28nC)
• Low Crss ( typical 24pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
Absolute Maximum Ratings
Thermal Characteristics
* When mounted on the minimum pad size recommended (PCB Mount)
V
I
I
V
E
I
E
dv/dt
P
T
T
R
R
R
D
DM
AR
J
L
DSS
GSS
AS
AR
D
θJC
θJA
θJA
, T
Symbol
Symbol
STG
DS(on)
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient*
Thermal Resistance, Junction-to-Ambient
Drain-Source Voltage
Drain Current
Drain Current
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
= 0.85 Ω @V
GS
G
= 10 V
- Continuous (T
- Continuous (T
- Pulsed
- Derate above 25°C
S
C
= 25°C)
Parameter
Parameter
D
FQB Series
2
-PAK
D
C
C
= 25°C)
= 100°C)
www.DataSheet4U.com
1
Description
These N-Channel enhancement mode power field effect transis-
tors are produced using Fairchild’s proprietary, planar stripe,
DMOS technology.
This advanced technology has been especially tailored to mini-
mize on-state resistance, provide superior switching perfor-
mance, and withstand high energy pulse in the avalanche and
commutation mode. These devices are well suited for high effi-
ciency switched mode power supplies, electronic lamp ballasts
based on half bridge topology.
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
G
FQB9N50CF
-55 to +150
FQB9N50CF
± 30
1.38
500
300
173
300
5.7
9.6
4.5
36
S
9
5
0.72
62.5
40
D
FRFET
October 2006
www.fairchildsemi.com
Units
W/°C
Units
V/ns
°C/W
°C/W
°C/W
mJ
mJ
°C
°C
W
V
A
A
A
V
A
TM

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FQB9N50CF Summary of contents

Page 1

... R Thermal Resistance, Junction-to-Ambient θJA * When mounted on the minimum pad size recommended (PCB Mount) ©2006 Fairchild Semiconductor Corporation FQB9N50CF Rev. A Description = 10 V These N-Channel enhancement mode power field effect transis- GS tors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. ...

Page 2

... DD G ≤ 9A, di/dt ≤ 200A/µs, V ≤ Starting DSS, 4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ Essentially independent of operating temperature FQB9N50CF Rev. A Package Reel Size D2-PAK 330mm D2-PAK 330mm T = 25°C unless otherwise noted C Test Conditions = 250 µ ...

Page 3

... Figure 5. Capacitance Characteristics 2000 1600 C iss 1200 C oss 800 C rss 400 Drain-Source Voltage [V] DS FQB9N50CF Rev. A Figure 2. Transfer Characteristics ※ Notes : 1. 250µ s Pulse Test ℃ Figure 4. Body Diode Forward Voltage V = 10V 20V GS ※ ...

Page 4

... J Figure 9. Maximum Safe Operating Area Operation in This Area Limited by R DS(on Drain-SourceVoltage[V] DS Figure 11. Transient Thermal Response Curve FQB9N50CF Rev. A (Continued) Figure 8. On-Resistance Variation 3.0 2.5 2.0 1.5 1.0 ※ Notes : 0 250 µA D 0.0 -100 100 150 200 o C] Figure 10 ...

Page 5

... Unclamped Inductive Switching Test Circuit & Waveforms FQB9N50CF Rev. A Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms 5 www.fairchildsemi.com ...

Page 6

... FQB9N50CF Rev. A Peak Diode Recovery dv/dt Test Circuit & Waveforms 6 www.fairchildsemi.com ...

Page 7

... Mechanical Dimensions FQB9N50CF Rev. A D2-PAK 7 Dimensions in Millimeters www.fairchildsemi.com ...

Page 8

... PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete FQB9N50CF Rev. A OCX™ OCXPro™ ® OPTOLOGIC OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ ...

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