MM74HCT74M Fairchild Semiconductor, MM74HCT74M Datasheet - Page 8

• Manufacturer Part Number: MM74HCT74M
• Description: IC FLIP FLOP DUAL D-TYPE 14-SOIC
• Manufacturer: Fairchild Semiconductor
• Series: 74HCTr
• Type: D-Typer

Specifications of MM74HCT74M

• Function: Set(Preset) and Reset
• Output Type: Differential
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Frequency - Clock: 27MHz
• Delay Time - Propagation: 21ns
• Trigger Type: Positive Edge
• Current - Output High, Low: 4.8mA, 4.8mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Number Of Circuits: 2
• Logic Family: 74HCT
• Logic Type: D-Type Flip-Flop
• Polarity: Inverting/Non-Inverting
• Input Type: Single-Ended
• Propagation Delay Time: 35 ns
• High Level Output Current: - 4.8 mA
• Low Level Output Current: 4.8 mA
• Supply Voltage (max): 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 4.5 V
• Technology: CMOS
• Number Of Bits: 2
• Number Of Elements: 2
• Clock-edge Trigger Type: Positive-Edge
• Operating Supply Voltage (typ): 5V
• Package Type: SOIC N
• Frequency (max): 21MHz
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

©1984 Fairchild Semiconductor Corporation
MM74HCT74 Rev. 1.4.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
A. CONFORMS TO JEDEC REGISTRATION MO-153,
B. DIMENSIONS ARE IN MILLIMETERS
E. LANDPATTERN STANDARD: SOP65P640X110-14M
D. DIMENSIONING AND TOLERANCES PER ANSI
F. DRAWING FILE NAME: MTC14REV6
AND TIE BAR EXTRUSIONS
VARIATION AB, REF NOTE 6
Y14.5M, 1982
Figure 3. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
0.43 TYP
(Continued)
8
0.65
R0.09 min
0.45
1.65
1.00
R0.09min
12.00°
TOP & BOTTOM
6.10
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