isl6312a Intersil Corporation, isl6312a Datasheet - Page 34

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isl6312a

Manufacturer Part Number
isl6312a
Description
Four-phase Buck Pwm Controller With Integrated Mosfet Drivers For Intel Vr10, Vr11, And Amd Applications
Manufacturer
Intersil Corporation
Datasheet

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Current Sense Component Placement and Trace
Routing
One of the most critical aspects of the ISL6312A regulator
layout is the placement of the inductor DCR current sense
components and traces. The R-C current sense components
must be placed as close to their respective ISEN+ and
ISEN- pins on the ISL6312A as possible.
The sense traces that connect the R-C sense components to
each side of the output inductors should be routed on the
bottom of the board, away from the noisy switching
components located on the top of the board. These traces
should be routed side by side, and they should be very thin
traces. It’s important to route these traces as far away from
any other noisy traces or planes as possible. These traces
should pick up as little noise as possible.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
For information regarding Intersil Corporation and its products, see www.intersil.com
34
ISL6312A
Thermal Management
For maximum thermal performance in high current, high
switching frequency applications, connecting the thermal
GND pad of the ISL6312A to the ground plane with multiple
vias is recommended. This heat spreading allows the part to
achieve its full thermal potential. It is also recommended
that the controller be placed in a direct path of airflow if
possible to help thermally manage the part.
August 1, 2007
FN9290.3

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