mc68hc705k1 Freescale Semiconductor, Inc, mc68hc705k1 Datasheet - Page 133

• Manufacturer Part Number: mc68hc705k1
• Description: Hcmos Microcontroller Unit
• Manufacturer: Freescale Semiconductor, Inc

13.1 Contents
13.2 Introduction
MC68HC705K1 — Rev. 2.0
Technical Data — MC68HC705K1
13.2
13.3
13.4
13.5
Package dimensions available at the time of this publication for the
MC68HC705K1 are provided in this section. The packages are:
To make sure that you have the latest case outline specifications,
contact one of the following:
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.
•
•
•
•
•
•
Freescale Semiconductor, Inc.
For More Information On This Product,
16-pin plastic dual in-line package (PDIP)
16-pin small outline integrated circuit package (SOIC)
16-pin ceramic DIP (cerdip)
Local Motorola Sales Office
Motorola Mfax
– Phone [phone]
– EMAIL [e-mail]
Worldwide Web (wwweb) at http://www.mcu.motsps.com
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133
Plastic Dual In-Line Package (Case 648) . . . . . . . . . . . . . . . .134
Small Outline Integrated Circuit (Case 751) . . . . . . . . . . . . . .134
Ceramic Dual In-Line Package (Case 620) . . . . . . . . . . . . . .135
Section 13. Mechanical Specifications
Go to: www.freescale.com
Mechanical Specifications
Technical Data