mc68hc711k4 Freescale Semiconductor, Inc, mc68hc711k4 Datasheet - Page 279

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mc68hc711k4

Manufacturer Part Number
mc68hc711k4
Description
Hcmos Microcontroller Unit
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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13.7 68-Pin Plastic Leaded Chip Carrier (Case 779)
M68HC11K Family
MOTOROLA
-L-
C
Z
K1
K
VIEW S
0.010
68
G
S
F
H
G1
T
A
R
L-M
0.007
0.007
1
-N-
S
Freescale Semiconductor, Inc.
N
M
M
S
For More Information On This Product,
T
T
L-M
L-M
S
VIEW S
V
0.007
S
0.007
Y
J
N
Go to: www.freescale.com
E
-M-
N
BRK
W
S
S
M
M
D
D
Mechanical Data
T
-T-
T
L-M
0.004
L-M
SEATING
PLANE
S
S
N
N
DIM
G1 0.910
K1 0.040
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
S
S
0.985
0.985
0.165
0.090
0.013
0.026
0.020
0.025
0.950
0.950
0.042
0.042
0.042
MIN
0.050 BSC
2
---
INCHES
0.995
0.995
0.180
0.110
0.019
0.032
0.956
0.956
0.048
0.048
0.056
0.020
0.930
MAX
68-Pin Plastic Leaded Chip Carrier (Case 779)
10
---
---
---
B
Z
U
0.007
X
VIEW D-D
NOTES:
1.
2.
3.
4.
5.
6.
7.
0.007
M
DATUMS L, M, AND N DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM T, SEATING PLANE.
DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 PER
SIDE.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012.
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC
BODY EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD FLASH,
BUT INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037. THE
DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025.
T
M
L-M
T
L-M
S
0.010
G1
N
S
S
N
S
S
T
Mechanical Data
L-M
Technical Data
S
N
S
279

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