sta339bw STMicroelectronics, sta339bw Datasheet - Page 73

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sta339bw

Manufacturer Part Number
sta339bw
Description
2.1-channel High-efficiency Digital Audio System
Manufacturer
STMicroelectronics
Datasheet

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STA339BW
8
Package thermal characteristics
Using a double-layer PCB the thermal resistance junction to ambient with 2 copper ground
areas of 3 x 3 cm
The dissipated power within the device depends primarily on the supply voltage, load
impedance and output modulation level.
Thus, the maximum estimated dissipated power for the STA339BW is:
Figure 24. Double-layer PCB with 2 copper ground areas and 16 via holes
Figure 25
copper areas of 2 x 2 cm
Figure 25. PowerSSO-36 power derating curve
2 x 20 W @ 8 Ω, 18 V
2 x 10 W + 1 x 20 W @ 4 Ω, 8 Ω, 18 V
shows the power derating curve for the PowerSSO-36 package on PCBs with
Pd (W)
Pd (W)
2
and with 16 via holes (see
8
8
8
8
8
8
7
7
7
7
7
7
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6
6
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5
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4
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3
3
3
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2
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2
2
2
1
1
1
1
1
1
0
0
0
0
0
0
0
0
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0
0
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2
and 3 x 3 cm
Copper Area 2x2 cm
Copper Area 2x2 cm
and via holes
and via holes
20
20
20
20
20
Doc ID 15251 Rev 4
40
40
40
40
40
Copper Area 3x3 cm
Copper Area 3x3 cm
and via holes
and via holes
2
.
60
60
60
60
60
Figure
Tamb ( °C)
Tamb ( °C)
Pd max ~ 4 W
Pd max < 5 W
80
80
80
80
80
24) is 24 °C/W in natural air convection.
100
100
100
100
100
Package thermal characteristics
STA339BW
PowerSSO-36
120
120
120
120
120
STA339BW
STA339BW
PSSO36
PSSO36
140
140
140
140
140
160
160
160
160
160
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