MC68HC705 MOTOROLA [Motorola, Inc], MC68HC705 Datasheet - Page 190

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MC68HC705

Manufacturer Part Number
MC68HC705
Description
HCMOS Microcontroller Unit
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet

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Mechanical Specifications
14.3 40-Pin Plastic Dual In-Line Package (PDIP)
Technical Data
190
1
40
H
Figure 14-1. MC68HC705C8AP Package Dimensions (Case #711)
G
To make sure that you have the latest case outline specifications,
contact one of the following:
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.
A
F
Local Motorola Sales Office
Motorola Mfax
– Phone 602-244-6609
– EMAIL rmfax0@email.sps.mot.com
Worldwide Web (wwweb) at http://design-net.com
D
Mechanical Specifications
21
20
SEATING
PLANE
N
K
B
C
M
L
J
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
FORMED PARALLEL.
MC68HC705C8A — Rev. 2.0
DIM
A
B
C
D
G
H
K
M
N
F
J
L
51.69
13.72
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
MILLIMETERS
0
15.24 BSC
2.54 BSC
52.45
14.22
MAX
5.08
0.56
1.52
2.16
0.38
3.43
1.02
1
2.035
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
MIN
MOTOROLA
0
0.100 BSC
0.600 BSC
INCHES
2.065
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
MAX
1

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