W25Q64DWSFIG WINBOND [Winbond], W25Q64DWSFIG Datasheet - Page 7

• Manufacturer Part Number: W25Q64DWSFIG
• Description: 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
• Manufacturer: WINBOND [Winbond]

6. PIN CONFIGURATION SOIC 300-MIL
7. PIN DESCRIPTION SOIC 300-MIL
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI/QPI instructions
PAD NO.
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
/HOLD (IO
PAD NAME
/HOLD (IO3)
/WP (IO2)
DO (IO1)
Figure 1c. W25Q64DW Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)
DI (IO0)
DO (IO
GND
VCC
CLK
N/C
N/C
N/C
N/C
/CS
N/C
N/C
N/C
N/C
VCC
/CS
NC
NC
NC
NC
3
1
)
)
I/O
I/O
I/O
I/O
I/O
I
I
1
2
3
4
5
6
7
8
Hold Input (Data Input Output 3)*
Power Supply
No Connect
No Connect
No Connect
No Connect
Chip Select Input
Data Output (Data Input Output 1)*
Write Protect Input (Data Input Output 2)*
Ground
No Connect
No Connect
No Connect
No Connect
Data Input (Data Input Output 0)*
Serial Clock Input
Top View
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Publication Release Date: January 13, 2011
FUNCTION
CLK
DI (IO
NC
NC
NC
NC
GND
/WP (IO
2
1
1
0
)
2
)
2
Preliminary - Revision C
W25Q64DW