W25Q64DWSFIG WINBOND [Winbond], W25Q64DWSFIG Datasheet - Page 73

• Manufacturer Part Number: W25Q64DWSFIG
• Description: 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
• Manufacturer: WINBOND [Winbond]

11.7 AC Electrical Characteristics (
Notes:
DESCRIPTION
/HOLD Active Hold Time relative to CLK
/HOLD Not Active Setup Time relative to CLK
/HOLD Not Active Hold Time relative to CLK
/HOLD to Output Low-Z
/HOLD to Output High-Z
Write Protect Setup Time Before /CS Low
Write Protect Hold Time After /CS High
/CS High to Power-down Mode
/CS High to Standby Mode without Electronic
Signature Read
/CS High to Standby Mode with Electronic Signature
Read
/CS High to next Instruction after Suspend
/CS High to next Instruction after Reset
Write Status Register Time
Byte Program Time (First Byte)
Additional Byte Program Time (After First Byte)
Page Program Time
Sector Erase Time (4KB)
Block Erase Time (32KB)
Block Erase Time (64KB)
Chip Erase Time
1.
2.
3.
4.
5.
Clock high + Clock low must be less than or equal to 1/f
Value guaranteed by design and/or characterization, not 100% tested in production.
Only applicable as a constraint for a Write Status Register instruction when SRP[1:0]=(0,1).
For multiple bytes after first byte within a page,
number of bytes programmed.
Max Value t
SE
with <50K cycles is 200ms and >50K & <100K cycles is 400ms.
(4)
cont’d)
(4)
t
BPN
- 73 -
=
C
t
.
BP1 +
SYMBOL
t
t
t
t
t
t
HHQX
WHSL
SHWL
HLQZ
RES
RES
t
t
t
t
t
t
SUS
RST
CHHH
HHCH
CHHL
DP
t
t
t
t
t
t
t
BE
BE
t
BP1
BP2
t
PP
SE
CE
W
BP2 * N
1
2
(2)
(2)
(2)
1
2
(2)
(2)
(2)
(2)
(3)
(3)
(typical) and
Publication Release Date: January 13, 2011
ALT
t
t
HZ
LZ
MIN
100
t
20
BPN
5
5
5
=
t
BP1 +
TYP
120
150
2.5
0.7
Preliminary - Revision C
10
20
30
15
W25Q64DW
SPEC
t
BP2 * N
200/400
(max), where N =
1,000
MAX
800
12
30
30
20
30
15
50
10
60
7
3
3
(5)
UNIT
ms
ms
ms
ms
ms
ns
ns
ns
ns
ns
ns
ns
µs
µs
µs
µs
µs
µs
µs
s