W25Q64DWSFIG WINBOND [Winbond], W25Q64DWSFIG Datasheet - Page 70

• Manufacturer Part Number: W25Q64DWSFIG
• Description: 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
• Manufacturer: WINBOND [Winbond]

11.4 DC Electrical Characteristics
Notes:
1. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 1.8V.
2. Checker Board Pattern.
PARAMETER
Input Capacitance
Output Capacitance
Input Leakage
I/O Leakage
Standby Current
Power-down Current
Current Read Data /
Dual /Quad 1MHz
Current Read Data /
Dual /Quad 50MHz
Current Read Data /
Dual /Quad 80MHz
Current Read Data /
Dual Output Read/Quad
Output Read 104MHz
Current Write Status
Register
Current Page Program
Current Sector/Block
Erase
Current Chip Erase
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
(2)
(2)
(2)
(2)
SYMBOL
C
Cout
I
I
I
I
I
I
I
I
I
I
I
I
V
V
V
V
LI
LO
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
IL
IH
OL
OH
IN (1)
1
2
3
3
3
3
4
5
6
7
(1)
CONDITIONS
V
V
/CS = VCC,
VIN = GND or VCC
/CS = VCC,
VIN = GND or VCC
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
/CS = VCC
/CS = VCC
/CS = VCC
/CS = VCC
I
I
OL
OH
IN
OUT
= 100 µA
= 0V
= –100 µA
= 0V
(1)
(1)
- 70 -
VCC x 0.7
VCC – 0.2
MIN
–0.5
SPEC
TYP
10
20
20
20
1
8
W25Q64DW
VCC x 0.3
VCC + 0.4
MAX
0.2
40
20
15
20
30
40
12
25
25
25
±2
±2
6
8
UNIT
mA
mA
mA
mA
mA
mA
mA
mA
µA
µA
µA
µA
pF
pF
V
V
V
V