W25Q64DWSFIG WINBOND [Winbond], W25Q64DWSFIG Datasheet - Page 77

• Manufacturer Part Number: W25Q64DWSFIG
• Description: 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
• Manufacturer: WINBOND [Winbond]

8-Contact 6x5mm WSON Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
SYMBOL
M
N
P
Q
R
Min
MILLIMETERS
SOLDER PATTERN
Nom
3.40
4.30
6.00
0.50
0.75
- 77 -
Max
Min
Publication Release Date: January 13, 2011
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Preliminary - Revision C
W25Q64DW
Max