W25Q64DWSFIG WINBOND [Winbond], W25Q64DWSFIG Datasheet - Page 79

• Manufacturer Part Number: W25Q64DWSFIG
• Description: 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
• Manufacturer: WINBOND [Winbond]

12.4 16-Pin SOIC 300-mil (Package Code SF)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
e
A1
A2
E1
A
C
D
E
θ
b
L
y
(2)
10.08
10.01
Min
2.36
0.10
0.33
0.18
7.39
0.38
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0°
MILLIMETERS
Nom
10.31
10.31
1.27 BSC.
2.49
2.31
0.41
0.23
7.49
0.81
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---
---
10.49
10.64
0.076
Max
2.64
0.30
0.51
0.28
7.59
1.27
- 79 -
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8°
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.015
Min
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0°
Publication Release Date: January 13, 2011
0.050 BSC.
INCHES
Nom
0.098
0.091
0.016
0.009
0.406
0.406
0.295
0.032
DETAIL A
DETAIL A
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Max
0.104
0.012
0.020
0.011
0.413
0.419
0.299
0.050
0.003
Preliminary - Revision C
W25Q64DW
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8°
GAUGE PLANE
GAUGE PLANE