74LCX16373MEAX Fairchild Semiconductor, 74LCX16373MEAX Datasheet

74LCX16373MEAX

Manufacturer Part Number

74LCX16373MEAX

Description

IC LATCH TRANSP 16BIT LV 48SSOP

Manufacturer

Fairchild Semiconductor

Series

74LCXr

Datasheet

1.74LCX16373MTD.pdf (10 pages)

Specifications of 74LCX16373MEAX

Logic Type

D-Type Transparent Latch

Circuit

8:8

Output Type

Tri-State

Voltage - Supply

2 V ~ 3.6 V

Independent Circuits

Delay Time - Propagation

1.5ns

Current - Output High, Low

24mA, 24mA

Operating Temperature

-40°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

48-SSOP

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

74LCX16373MEAX

Manufacturer:

FAIRCHILD/仙童

Quantity:

20 000

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Khoo, EC

E-mail: EC.Khoo@fairchildsemi.com

Phone: 604-6437211 ext. 2452

Implementation of change:

Expected 1st Device Shipment Date: 2008/12/07

Earliest Year/Work Week of Changed Product: 0850

Change Type Description: Die Attach Material, Mold Compound

Description of Change (From): SSOP-48 & -56 lead packages assemble with Sumitomo

non-green mold compound, EME-6700 and Ablestik die-attach epoxy, JM-2000LB as shown in

Table 1.

Description of Change (To): SSOP-48 & -56 lead packages assemble with Sumitomo green

mold compound, EME-G630M and die-attach epoxy, CRM-1064L as shown in Table 2.

Reason for Change : Sumitomo Bakelite had discontinued production of EME-6700 mold

compound since March 2008 and Ablestik will discontinue production of die-attach epoxy

JM-2000LB in January 2009. Replace non-green by green (Halogen-free Flame Retardant)

mold compound is to align with the Green Initiative by Fairchild Semiconductor and is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance.The reference material changes have been made to

provide a 'full green' package. For additional details on the corporate wide Green Initiative,

please visit our Web site: http://www.fairchildsemi.com/company/green/index.html

Manufacturing will occur at the same assembly facility producing the current non-green

products. Package outline drawings of the affected products remain unchanged. Green products

will be fully compliant to all published data sheet specifications. Quality and reliability will

remain at the highest standards already demonstrated with existing products.

Qual/REL Plan Numbers : Q20070484

Qualification :

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Lee, Chan Shyong

E-mail: Chan.Shyong.Lee@fairchildsemi.com

Phone: 604-6437211 ext. 2645

Date Issued On : 2008/09/10

Date Created : 2008/09/01

PCN# : Q3083601

Pg. 1

Related parts for 74LCX16373MEAX

74LCX16373MEAX Summary of contents

Page 1

... JM-2000LB in January 2009. Replace non-green by green (Halogen-free Flame Retardant) mold compound is to align with the Green Initiative by Fairchild Semiconductor and is dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level interconnect lead-free and RoHS compliance.The reference material changes have been made to provide a 'full green' package ...

Page 2

... All reliability tests outlined in Q20070484 qualification plan were successfully completed with no failure detected and meet the requirements for release. As such, SSOP-48 & -56 lead packages manufacture in Fairchild Semiconductor Malaysia are qualified to be assembled with die-attach epoxy CRM-1064L and green mold compound EME-G630M. ...

Page 3

Q20070484CAGATE+ GTLP18T612MEA Q20070484CBGATE+ GTLP18T612MEA Test: (High Temperature Storage Life) Lot Device Q20070484AAHTSL 74LVTH16501MEA Q20070484ABHTSL Q20070484BAHTSL 74ABT16543CSSC Q20070484BBHTSL Q20070484CAHTSL GTLP18T612MEA Q20070484CBHTSL Test: (Static Op Life) Lot Device Q20070484AASOPL1 74LVTH16501MEA Q20070484ABSOPL1 Q20070484BASOPL1 74ABT16543CSSC Q20070484BBSOPL1 Q20070484CASOPL1 GTLP18T612MEA Q20070484CBSOPL1 Test: -65C, 150C (Temperature Cycle) ...

Page 4

... GTLP16612MEAX GTLP18T612MEAX SCAN18245TSSC SCAN18540TSSCX 74ABT16245CSSCX 74ABT16374CSSC 74ABT16543CSSCX 74ABT16652CSSC 74ACT16245SSCX 74ACT16373SSC 74ACTQ16244SSCX 74ACTQ16245SSC 74ACTQ16374SSCX 74ACTQ16541SSC 74LCX162244MEAX 74LCX162373MEA 74LCX16240MEAX 74LCX16244MEA 74LCX16373MEAX 74LCX16374MEA 74LCX16501MEAX 74LCX16543MEA 74LCX16652MEAX 74LCX16821MEA 74LCXH162244MEA 74LCXH16244MEA 74LCXP16245MEAX 74LCXR162245MEX 74LVT162244MEAX 74LVT162245MEA 74LVT16245MEAX 74LVT16373MEA 74LVTH162244MEA 74LVTH162245MEX 74LVTH16244MEAX 74LVTH16245MEA 74LVTH16374MEAX 74LVTH16543MEA 74LVTH16652MEAX ...

Page 5

SCAN18541TSSCX SCAN18541TSSC Pg. 5 ...

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