TWR-12311-KIT-NA Freescale Semiconductor, TWR-12311-KIT-NA Datasheet - Page 18

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TWR-12311-KIT-NA

Manufacturer Part Number
TWR-12311-KIT-NA
Description
Development Boards & Kits - Other Processors Tower Kit for NA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of TWR-12311-KIT-NA

Rohs
yes
Product
Development Systems
Tool Is For Evaluation Of
MC12311
Core
HCS08
Interface Type
SPI, USB
Operating Supply Voltage
3.5 V to 10 V
Data Bus Width
8 bit
For Use With
MC12311
12311-MRB
The 12311-MRB utilizes a flexible RF path topology that make it suitable for working in different
frequency bands by replacing a minimum number of components while providing good RF performance.
Following Tables shows the different BOM according to different Frequency Bands of operation.
3.2.2
The MC12311 provides for two clocks:
3-6
32 MHz Reference Oscillator -
mounted crystal must meet the MC12311 specifications.
— Capacitors C22 and C25 provide the bulk of the crystal load capacitance.
— Signal DIO5/CLKOUT can be used to supply an external clock to MCU die and to measure a
— The 12311-MRB has provision for injecting an external 32 MHz clock source as an alternative
Optional 32.768 kHz Crystal Oscillator - Provision is also made for a secondary 32.768 kHz crystal
Y2 (see
the 32MHz oscillator frequency.
to use of the onboard crystal:
– The crystal Y1 should be removed
– C23 must be mounted
– The external 32 MHz source is connected to 2-pin header J4.
Clocks
See the MC12311 Data Sheet and Reference Manual for more RF design
information.
Figure
3-6). This oscillator can be used for a low power accurate time base.
12311 Development Hardware Reference Manual, Rev. 0.0
Figure 3-4. 12311-MRB RF Circuitry
Figure 3-5
NOTE
shows the external 32 MHz external crystal Y1. This
Freescale Semiconductor

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