TC58FVM6T5BTG65 Toshiba, TC58FVM6T5BTG65 Datasheet - Page 2

• Manufacturer Part Number: TC58FVM6T5BTG65
• Description: IC FLASH 64MBIT 65NS 48TSOP
• Manufacturer: Toshiba

Specifications of TC58FVM6T5BTG65

• Format - Memory: FLASH
• Memory Type: FLASH - Nor
• Memory Size: 64M (8Mx8, 4Mx16)
• Speed: 65ns
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

TABLE OF CONTENTS
64M (4M × 16 BITS) CMOS FLASH MEMORY .................................................................................................................................. 1
1. DESCRIPTION................................................................................................................................................................................. 1
2. FEATURES ...................................................................................................................................................................................... 1
3. ORDERING INFORMATION.......................................................................................................................................................... 3
4.PIN ASSIGNMENT (TOP VIEW) .................................................................................................................................................... 4
5. BLOCK DIAGRAM........................................................................................................................................................................... 5
6. MODE SELECTION ........................................................................................................................................................................ 6
7. ID CODE TABLE ............................................................................................................................................................................. 6
8. COMMAND SEQUENCES .............................................................................................................................................................. 7
9. SIMULTANEOUS READ/WRITE OPERATION............................................................................................................................ 9
10. OPERATION MODES.................................................................................................................................................................. 10
11. DATA PROTECTION................................................................................................................................................................... 26
12. ABSOLUTE MAXIMUM RATINGS............................................................................................................................................ 27
13. CAPACITANCE (T
14. RECOMMENDED DC OPERATING CONDITIONS................................................................................................................. 27
15. DC CHARACTERISTICS............................................................................................................................................................. 28
16. AC TEST CONDITIONS.............................................................................................................................................................. 28
17. AC CHARACTERISTICS AND OPERATING CONDITIONS ................................................................................................... 29
18. TIMING DIAGRAMS ................................................................................................................................................................... 32
19. FLOWCHARTS ............................................................................................................................................................................ 48
20. BLOCK ADDRESS TABLES ....................................................................................................................................................... 65
21. BLOCK SIZE TABLE................................................................................................................................................................... 75
22. PACKAGE DIMENSIONS........................................................................................................................................................... 77
10.1. Read Mode.............................................................................................................................................................................. 10
10.2. ID Read Mode......................................................................................................................................................................... 10
10.3. Standby Mode ........................................................................................................................................................................ 10
10.4. Auto-Sleep Mode .................................................................................................................................................................... 10
10.5. Output Disable Mode............................................................................................................................................................. 10
10.6. Command Write ......................................................................................................................................................................11
10.7. Software Reset: Read/Reset Command..................................................................................................................................11
10.8. Hardware Reset ......................................................................................................................................................................11
10.9. Comparison between Software Reset and Hardware Reset..................................................................................................11
10.10. Auto-Program Mode............................................................................................................................................................. 12
10.11. Auto-Page Program Mode .................................................................................................................................................... 12
10.12. Fast Program Mode ............................................................................................................................................................. 12
10.13. Acceleration Mode ................................................................................................................................................................ 12
10.14. Program Suspend/Resume Mode ........................................................................................................................................ 13
10.15. Auto Chip Erase Mode ......................................................................................................................................................... 13
10.16. Auto Block Erase/Auto Multi-Block Erase Modes .............................................................................................................. 13
10.17. Erase Suspend/Erase Resume Modes ................................................................................................................................. 14
10.18. Block Protection ................................................................................................................................................................... 15
10.19. Hidden ROM Area................................................................................................................................................................ 20
10.20. CFI (Common Flash memory Interface) ............................................................................................................................. 21
10.21. HARDWARE SEQUENCE FLAGS..................................................................................................................................... 24
11.1. Protection against Program/Erase Caused by Low Supply Voltage .................................................................................... 26
11.2. Protection against Malfunction Caused by Glitches ............................................................................................................ 26
11.3. Protection against Malfunction at Power-on ........................................................................................................................ 26
17.1. Read Cycle.............................................................................................................................................................................. 29
17.2. Block Protect .......................................................................................................................................................................... 29
17.3. Program and Erase characteristics....................................................................................................................................... 30
17.4. Command Write/Program/Erase cycle .................................................................................................................................. 31
20.1. TC58FVM6T5B (Top Boot Block) 1/5 ................................................................................................................................. 65
20.2. TC58FVM6B5B (Bottom Boot Block) 1/5 ........................................................................................................................... 70
21.1. TC58FVM6T5B (Top Boot Block) .......................................................................................................................................... 75
21.2. TC58FVM6B5B (Bottom Boot Block).................................................................................................................................... 76
A
= 25°C,
F
= 1 MH
Z
) ..................................................................................................................................... 27
TC58FVM6(T/B)5B(TG/XG)65
2006-05-10 2/80