HIP6602BCBZ Intersil, HIP6602BCBZ Datasheet - Page 12

IC DRIVER MOSFET QUAD 14-SOIC

HIP6602BCBZ

Manufacturer Part Number
HIP6602BCBZ
Description
IC DRIVER MOSFET QUAD 14-SOIC
Manufacturer
Intersil
Datasheet

Specifications of HIP6602BCBZ

Configuration
High and Low Side, Synchronous
Input Type
PWM
Current - Peak
400mA
Number Of Configurations
2
Number Of Outputs
4
High Side Voltage - Max (bootstrap)
15V
Voltage - Supply
10.8 V ~ 13.2 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Delay Time
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HIP6602BCBZ-T
Manufacturer:
SMD
Quantity:
38
Part Number:
HIP6602BCBZ-T
Manufacturer:
INTERSIL-PB
Quantity:
827
Part Number:
HIP6602BCBZ-T
Manufacturer:
INTERSIL
Quantity:
20 000
Small Outline Plastic Packages (SOIC)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C A
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
SEATING PLANE
M
For information regarding Intersil Corporation and its products, see www.intersil.com
-C-
E
-B-
B S
A
12
H
A1
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
C
HIP6602B
M14.15
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-012-AB ISSUE C)
0.0532
0.0040
0.013
0.0075
0.3367
0.1497
0.2284
0.0099
0.016
MIN
0
0.050 BSC
o
INCHES
14
0.0688
0.0098
0.020
0.0098
0.3444
0.1574
0.2440
0.0196
0.050
MAX
8
o
MILLIMETERS
1.35
0.10
0.33
0.19
8.55
3.80
5.80
0.25
0.40
MIN
0
o
1.27 BSC
14
MAX
1.75
0.25
0.51
0.25
8.75
4.00
6.20
0.50
1.27
8
o
Rev. 0 12/93
July 22, 2005
NOTES
FN9076.5
9
3
4
5
6
7
-
-
-
-
-
-

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