MT18VDDF12872HY-335D1 Micron Technology Inc, MT18VDDF12872HY-335D1 Datasheet - Page 26

• Manufacturer Part Number: MT18VDDF12872HY-335D1
• Description: MODULE SDRAM DDR 512MB 200SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT18VDDF12872HY-335D1

• Memory Type: DDR SDRAM
• Memory Size: 1GB
• Speed: 333MT/s
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 72b
• Organization: 128Mx72
• Total Density: 1GByte
• Chip Density: 512Mb
• Access Time (max): 700ps
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 1.53A
• Number Of Elements: 18
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 20: Serial Presence-Detect Matrix (Continued)
“1”/“0”: Serial Data, “driven to HIGH”/“driven to LOW”; notes appear on page 26
NOTE:
09005aef80e487d7
DDF18C64_128x72HG_A.fm - Rev. A 10/03 EN
1. Device latencies used for SPD values.
2. The value of
3. The JEDEC SPD specification allows fast or slow slew rate values for these bytes. The worst-case (slow slew rate) value is
99-127 Manufacturer-Specific Data (RSVD)
48–61
BYTE
36-40
65-71
73-90
95-98
represented here. Systems requiring the fast slew rate setup and hold values are supported, provided the faster mini-
mum slew rate is met.
32
33
34
35
41
42
43
44
45
46
47
62
63
64
72
91
92
93
94
Address and Command Setup Time, (
(See note 3)
Address and Command Hold Time, (
(See note 3)
Data/ Data Mask Input Setup Time, (
Data/ Data Mask Input Hold Time, (
Reserved
Minimum Active Auto Refresh Time (
Minimum Auto Refresh to Active/Auto Refresh
Command Period, (
SDRAM Device Max Cycle Time (
SDRAM Device Max DQS-DQ Skew Time
(
SDRAM Device Max Read Data Hold Skew
Factor (
Reserved
DIMM Height
Reserved
SPD Revision
Checksum for Bytes 0-62
Manufacturer’s JEDEC ID Code
Manufacturer’s JEDEC ID Code (Continued)
Manufacturing Location
Module Part Number (ASCII)
PCB Identification Code
Identification Code (Continued)
Year of Manufacture in BCD
Week of Manufacture in BCD
Module Serial Number
t
DQSQ)
t
RAS used for -262/-26A/-265 modules is calculated from
t
QHS)
DESCRIPTION
t
RFC)
t
CK
t
MAX
t
DH)
t
IH)
t
DS)
t
IS)
RC)
)
0.5ns (-262/-26A/-265)
0.5ns (-262/-26A/-265)
0.5ns (-262/-26A/-265)
75ns (-262/-26A/-265)
13ns (-262/-26A/-265)
26
1ns (-262/-26A/-265)
1ns (-262/-26A/-265)
ENTRY (VERSION)
0.75ns (-26A/-265)
65ns (-26A/-265)
60ns (-335/-262)
0.45ns (-335)
0.45ns (-335)
0.40ns (-335)
0.8ns (-335)
0.8ns (-335)
0.5ns (-335)
Release 1.0
72ns (-335)
12ns (-335)
MICRON
01–12
-26A
-335
-262
-265
1-9
0
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
RC -
512MB, 1GB (x72, ECC, DR)
t
RP. Actual device spec value is 40 ns.
200-PIN DDR SODIMM
MT18VDDF6472H MT18VDDF12872H
Variable Data
Variable Data
Variable Data
Variable Data
01–0C
01-09
CD
A0
A0
2A
80
80
45
50
45
50
00
3C
41
48
4B
30
34
28
32
50
75
00
01
00
10
30
FA
2C
00
00
–
©2003 Micron Technology, Inc.
Variable Data
Variable Data
Variable Data
Variable Data
01–0D
01-09
A0
A0
80
80
45
50
45
50
00
3C
41
48
4B
30
34
28
32
50
75
00
01
00
10
71
0E
3B
6B
2C
00
00
–