MA180023 Microchip Technology, MA180023 Datasheet - Page 461

• Manufacturer Part Number: MA180023
• Description: MODULE PLUG-IN PIC18F46J11 PIM
• Manufacturer: Microchip Technology
• Series: PIC®r

Specifications of MA180023

• Accessory Type: Plug-In Module (PIM) - PIC18F46J11
• Tool / Board Applications: General Purpose MCU, MPU, DSP, DSC
• Mcu Supported Families: PIC18
• Supported Devices: Stand-alone Or W/ HPC(DM183022) Or PIC18(DM183032)
• Silicon Manufacturer: Microchip
• Core Architecture: PIC
• Core Sub-architecture: PIC18
• Silicon Core Number: PIC18F
• Silicon Family Name: PIC18FxxJxx
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: HPC Explorer Board (DM183022) or PIC18 Explorer Board (DM183032)
• For Use With: DM183032 - BOARD EXPLORER PICDEM PIC18DM183022 - BOARD DEMO PIC18FXX22 64/80TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

28.0
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any digital only I/O pin or MCLR with respect to V
Voltage on any combined digital and analog pin with respect to V
Voltage on V
Voltage on V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of V
Maximum current into V
Maximum output current sunk by any PORTB, PORTC and RA6 I/O pin...............................................................25 mA
Maximum output current sunk by any PORTA (except RA6), PORTD and PORTE I/O pin......................................4 mA
Maximum output current sourced by any PORTB, PORTC and RA6 I/O pin .........................................................25 mA
Maximum output current sourced by any PORTA (except RA6), PORTD and PORTE I/O pin ................................4 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
FIGURE 28-1:
© 2009 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows:
ELECTRICAL CHARACTERISTICS
P
DDCORE
DD
DIS
with respect to V
= V
DD
2.15V
with respect to V
4.0V
3.5V
3.0V
2.5V
PIC18F46J11 FAMILY V
x {I
DD
SS
DD
pin ..............................................................................................................................250 mA
0
pin ...........................................................................................................................300 mA
– ∑ I
SS
8 MHz
PIC18F46J11 Family Valid Operating Range
OH
(†)
........................................................................................................... -0.3V to 4.0V
} + ∑ {(V
SS
................................................................................................... -0.3V to 2.75V
DD
DD
– V
FREQUENCY GRAPH (INDUSTRIAL)
OH
) x I
OH
SS
PIC18F46J11 FAMILY
} + ∑ (V
(except V
SS
(except V
OL
DD
x I
) ........................................... -0.3V to 6.0V
OL
DD
)
)........................ -0.3V to (V
48 MHz
3.6V
2.35V
DS39932C-page 461
DD
+ 0.3V)