PIC12F635-I/P Microchip Technology, PIC12F635-I/P Datasheet - Page 112

• Manufacturer Part Number: PIC12F635-I/P
• Description: IC MCU FLASH 1KX14 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232/SPI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
• Minimum Operating Temperature: - 40 C
• Data Rom Size: 128 B
• Height: 3.3 mm
• Length: 9.27 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F635/PIC16F636/639
11.26 Factory Calibration
Microchip
device-to-device variation in standby current, internal
timing and sensitivity, as well as channel-to-channel
sensitivity variation.
11.27 De-Q’ing of Antenna Circuit
When the transponder is close to the base station, the
transponder coil may develop coil voltage higher than
V
detects the strong near field signal through the AGC
control, and de-Q’ing the antenna circuit to reduce the
input signal amplitude.
FIGURE 11-8:
DS41232D-page 110
DE
V
_
Legend:
BAT
Q
. This condition is called “near field”. The AFE
calibrates
D
D
C
BLOCK
BLOCK
D
C
R
POOL
D
R
FLAT
COM
COM
LIM
LIM
LF FIELD POWERING AND BATTERY BACK-UP EXAMPLE
= LCCOM charging capacitor.
= Pool capacitor (or battery back-up capacitor), charges in field and powers device.
= Battery protection from reverse charge.
= Field rectifier diodes.
= Voltage limiting diode, may be required to limit V
= C
= Current limiting resistor, required for air coil in strong fields.
the
Schottky for low forward bias drop.
D
COM
LIM
AFE
discharge path.
V
DD
to
C
POOL
reduce
D
D
the
FLAT
FLAT
1
2
Air Coil
L
X
11.28 Battery Back-up and Batteryless
The device supports both battery back-up and
batteryless operation by the addition of external
components, allowing the device to be partially or
completely powered from the field.
Figure 11-8 shows an example of the external circuit for
the battery back-up.
Note:
R
L
C
Y
COM
X
R
LIM
Operation
DD
Voltage on L
voltage must not exceed the maximum LC
input voltage.
C
C
voltage when in strong fields.
COM
Y
L
Z
© 2007 Microchip Technology Inc.
CCOM
C
Z
LCCOM
combined with coil input
LCX
LCY
LCZ