PIC12F635-I/P Microchip Technology, PIC12F635-I/P Datasheet - Page 181

• Manufacturer Part Number: PIC12F635-I/P
• Description: IC MCU FLASH 1KX14 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232/SPI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
• Minimum Operating Temperature: - 40 C
• Data Rom Size: 128 B
• Height: 3.3 mm
• Length: 9.27 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

15.10 AC Characteristics: PIC12F635/PIC16F636/639 (Industrial, Extended)
FIGURE 15-5:
TABLE 15-1:
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
OS01
OS02
OS03
OS04*
OS05*
Note 1:
Param
(LP, XT, HS Modes)
No.
OSC2/CLKOUT
OSC2/CLKOUT
(CLKOUT Mode)
OSC1/CLKIN
*
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and
F
T
T
TosH,
TosL
TosR,
TosF
OSC
CY
Sym
OSC
These parameters are characterized but not tested.
are not tested.
Instruction cycle period (T
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for
all devices.
External CLKIN Frequency
Oscillator Frequency
External CLKIN Period
Oscillator Period
Instruction Cycle Time
External CLKIN High,
External CLKIN Low
External CLKIN Rise,
External CLKIN Fall
CLOCK OSCILLATOR TIMING REQUIREMENTS
CLOCK TIMING
Characteristic
Q4
-40°C
(1)
CY
T
(1)
) equals four times the input oscillator time base period. All specified values are
A
(1)
(1)
OS02
+125°C
Q1
(1)
PIC12F635/PIC16F636/639
Min
250
250
250
200
100
DC
DC
DC
DC
DC
0.1
27
50
50
50
20
—
—
1
2
0
0
0
Q2
32.768
Typ†
30.5
T
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CY
OS03
10,000
OS04
1,000
Max
DC
37
20
20
20
50
25
15
—
—
—
—
—
—
4
4
4
Q3
OS04
Units
MHz
MHz
MHz
MHz
MHz
MHz
kHz
kHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
s
s
s
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
EC Oscillator mode
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
RC Oscillator mode
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
EC Oscillator mode
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
RC Oscillator mode
T
LP oscillator
XT oscillator
HS oscillator
LP oscillator
XT oscillator
HS oscillator
CY
Q4
= 4/F
OSC
Conditions
DS41232D-page 179
Q1