PIC24FJ16GA002-E/ML Microchip Technology, PIC24FJ16GA002-E/ML Datasheet - Page 260

IC PIC MCU FLASH 16K 28-QFN

PIC24FJ16GA002-E/ML

Manufacturer Part Number
PIC24FJ16GA002-E/ML
Description
IC PIC MCU FLASH 16K 28-QFN
Manufacturer
Microchip Technology
Series
PIC® 24Fr

Specifications of PIC24FJ16GA002-E/ML

Program Memory Type
FLASH
Program Memory Size
16KB (5.5K x 24)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
21
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
I2C, IrDA, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, MA240013, AC164127, DM300027, DV164033, DM240002
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240011 - KIT STARTER MPLAB FOR PIC24F MCUAC162088 - HEADER MPLAB ICD2 24FJ64GA004 28AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24FJ16GA002-E/ML
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
PIC24FJ16GA002-E/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC24FJ64GA004 FAMILY
APPENDIX B:
B.1
Devices in the PIC24FJ64GA004 family include a num-
ber of core features to significantly reduce the applica-
tion’s power requirements. For truly power-sensitive
applications, it is possible to further reduce the
application’s power demands by taking advantage of
the device’s regulator architecture. These methods
help decrease power in two ways: by disabling the
internal voltage regulator to eliminate its power con-
sumption, and by reducing the voltage on V
lower the device’s dynamic current requirements.
Using these methods, it is possible to reduce Sleep
currents (I
refer
Table 27-6). For dynamic power consumption, the
reduction in V
regulator, to 2.0V can provide a power reduction of
about 30%.
When using a regulated power source or a battery with
a constant output voltage, it is possible to decrease
power consumption by disabling the regulator. In this
case (Figure B-1), a simple diode can be used to
reduce the voltage from 3V or greater to the 2V-2.5V
required for V
power supplies, such as Lithium Coin cells, which
maintain a constant voltage over the life of the battery.
DS39881D-page 260
to
Additional Methods for Power
Reduction
PD
specifications
) from 3.5 A to 250 nA (typical values,
DDCORE
DDCORE
. This method is only advised on
ADDITIONAL
GUIDANCE FOR
PIC24FJ64GA004
FAMILY
APPLICATIONS
from 2.5V, provided by the
DC60d
and
DC60g
DDCORE
to
in
FIGURE B-1:
A similar method can be used for non-regulated
sources (Figure B-2). In this case, it can be beneficial
to use a low quiescent current external voltage regula-
tor. Devices such as the MCP1700 consume only 1 A
to regulate to 2V or 2.5V, which is lower than the
current required to power the internal voltage regulator.
FIGURE B-2:
3.3V
‘AA’
Coin Cell
3.0V
MCP1700
POWER REDUCTION
POWER REDUCTION
EXAMPLE FOR CONSTANT
VOLTAGE SUPPLIES
EXAMPLE FOR
NON-REGULATED SUPPLIES
D1
 2010 Microchip Technology Inc.
2.0V
2.3V
V
DISVREG
V
V
V
DISVREG
V
V
DD
DDCORE
SS
PIC24FJ64GA
DD
DDCORE
SS
PIC24FJ64GA

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