PIC18F1230-I/SO Microchip Technology, PIC18F1230-I/SO Datasheet - Page 205

• Manufacturer Part Number: PIC18F1230-I/SO
• Description: IC PIC MCU FLASH 2KX16 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F1230-I/SO

• Core Size: 8-Bit
• Program Memory Size: 4KB (2K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 16
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 256Byte
• Cpu Speed: 40MHz
• No. Of Timers: 2
• Package: 18SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 16
• Interface Type: USART
• On-chip Adc: 4-chx10-bit
• Number Of Timers: 2
• Processor Series: PIC18F
• Core: PIC
• Data Ram Size: 256 B
• Maximum Clock Frequency: 40 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
• Minimum Operating Temperature: - 40 C
• Height: 2.31 mm
• Length: 11.53 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.2 V
• Width: 7.49 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

20.4
The Fail-Safe Clock Monitor (FSCM) allows the
microcontroller to continue operation in the event of an
external oscillator failure by automatically switching the
device clock to the internal oscillator block. The FSCM
function is enabled by setting the FCMEN Configuration
bit.
When FSCM is enabled, the INTRC oscillator runs at
all times to monitor clocks to peripherals and provide a
backup clock in the event of a clock failure. Clock
monitoring (shown in Figure 20-3) is accomplished by
creating a sample clock signal, which is the INTRC
output divided by 64. This allows ample time between
FSCM sample clocks for a peripheral clock edge to
occur. The peripheral device clock and the sample
clock are presented as inputs to the Clock Monitor latch
(CM). The CM is set on the falling edge of the device
clock source, but cleared on the rising edge of the
sample clock.
FIGURE 20-3:
Clock failure is tested for on the falling edge of the
sample clock. If a sample clock falling edge occurs
while CM is still set, a clock failure has been detected
(Figure 20-4). This causes the following:
• The FSCM generates an oscillator fail interrupt by
• The device clock source is switched to the internal
• The WDT is reset.
During switchover, the postscaler frequency from the
internal oscillator block may not be sufficiently stable for
timing sensitive applications. In these cases, it may be
desirable to select another clock configuration and enter
an alternate power-managed mode. This can be done to
attempt a partial recovery or execute a controlled shut-
down. See Section 4.1.4 “Multiple Sleep Commands”
and Section 20.3.1 “Special Considerations for
Using Two-Speed Start-up” for more details.
 2009 Microchip Technology Inc.
Peripheral
setting bit, OSCFIF (PIR2<7>).
oscillator block (OSCCON is not updated to show
the current clock source – this is the fail-safe
condition).
Source
(32 s)
INTRC
Clock
Fail-Safe Clock Monitor
(2.048 ms)
488 Hz
÷ 64
FSCM BLOCK DIAGRAM
(edge-triggered)
Clock Monitor
Latch (CM)
C
S
Q
Q
Detected
Failure
Clock
To use a higher clock speed on wake-up, the INTOSC
or postscaler clock sources can be selected to provide
a higher clock speed by setting bits, IRCF2:IRCF0,
immediately after Reset. For wake-ups from Sleep, the
INTOSC or postscaler clock sources can be selected
by setting the IRCF2:IRCF0 bits prior to entering Sleep
mode.
The FSCM will detect failures of the primary or
secondary clock sources only. If the internal oscillator
block fails, no failure would be detected, nor would any
action be possible.
20.4.1
Both the FSCM and the WDT are clocked by the
INTRC oscillator. Since the WDT operates with a
separate divider and counter, disabling the WDT has
no effect on the operation of the INTRC oscillator when
the FSCM is enabled.
As already noted, the clock source is switched to the
INTOSC clock when a clock failure is detected.
Depending on the frequency selected by the
IRCF2:IRCF0 bits, this may mean a substantial change
in the speed of code execution. If the WDT is enabled
with a small prescale value, a decrease in clock speed
allows a WDT time-out to occur and a subsequent
device Reset. For this reason, fail-safe clock events
also reset the WDT and postscaler, allowing it to start
timing from when execution speed was changed and
decreasing the likelihood of an erroneous time-out.
20.4.2
The fail-safe condition is terminated by either a device
Reset or by entering a power-managed mode. On
Reset, the controller starts the primary clock source
specified in Configuration Register 1H (with any
required start-up delays that are required for the
oscillator mode, such as the OST or PLL timer). The
INTOSC multiplexer provides the device clock until the
primary clock source becomes ready (similar to a Two-
Speed Start-up). The clock source is then switched to
the primary clock (indicated by the OSTS bit in the
OSCCON register becoming set). The Fail-Safe Clock
Monitor then resumes monitoring the peripheral clock.
The primary clock source may never become ready
during start-up. In this case, operation is clocked by the
INTOSC multiplexer. The OSCCON register will remain
in its Reset state until a power-managed mode is
entered.
PIC18F1230/1330
FSCM AND THE WATCHDOG TIMER
EXITING FAIL-SAFE OPERATION
DS39758D-page 205