PIC16F74-I/P Microchip Technology, PIC16F74-I/P Datasheet - Page 103
![IC MCU FLASH 4KX14 A/D 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F74-I/P
Manufacturer Part Number
PIC16F74-I/P
Description
IC MCU FLASH 4KX14 A/D 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F74-I/P
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
33
Program Memory Type
FLASH
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC16F
No. Of I/o's
33
Ram Memory Size
192Byte
Cpu Speed
20MHz
No. Of Timers
3
Package
40PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Operating Supply Voltage
5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
33
Interface Type
I2C/SPI/USART
On-chip Adc
8-chx8-bit
Number Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Ram Size
192 B
Maximum Clock Frequency
20 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Details
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- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F73-ISP PDF datasheet #4
- PIC16F73-ISP PDF datasheet #5
- PIC16F73-ISP PDF datasheet #6
- Current page: 103 of 688
- Download datasheet (3Mb)
6.3.3
1997 Microchip Technology Inc.
Banking
The data memory is partitioned into four banks. Each bank contains General Purpose Registers
and Special Function Registers. Switching between these banks requires the RP0 and RP1 bits
in the STATUS register to be configured for the desired bank when using direct addressing. The
IRP bit in the STATUS register is used for indirect addressing.
Table 6-1:
Each Bank extends up to 7Fh (128 bytes). The lower locations of each bank are reserved for the
Special Function Registers. Above the Special Function Registers are General Purpose Regis-
ters. All data memory is implemented as static RAM. All Banks may contain special function reg-
isters. Some “high use” special function registers from Bank0 are mirrored in the other banks for
code reduction and quicker access.
Through the evolution of the products, there are a few variations in the layout of the Data Memory.
The data memory organization that will be the standard for all new devices is shown in
Figure
reduce the software overhead for context switching. The registers in bold will be in every device.
The other registers are peripheral dependent. Not every peripheral’s registers are shown,
because some file addresses have a different registers from those shown. As with all the figures,
tables, and specifications presented in this reference guide, verify the details with the device spe-
cific data sheet.
Figure 6-4: Direct Addressing
Accessed
Bank
RP1 RP0
bank select
0
1
2
3
6-5. This Memory map has the last 16-bytes mapped across all memory banks. This is to
Section 6. Memory Organization
Direct and Indirect Addressing of Banks
(RP1:RP0)
Direct
location select
6
Direct Addressing
0 0
0 1
1 0
1 1
Data
Memory
from opcode
Indirect
(IRP)
7Fh
00h
0
1
Bank0
00
0
Bank1
01
Bank2
10
Bank3
11
DS31006A-page 6-9
7Fh
6
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