PIC16F74-I/P Microchip Technology, PIC16F74-I/P Datasheet - Page 277

• Manufacturer Part Number: PIC16F74-I/P
• Description: IC MCU FLASH 4KX14 A/D 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F74-I/P

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 33
• Program Memory Type: FLASH
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 33
• Ram Memory Size: 192Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 33
• Interface Type: I2C/SPI/USART
• On-chip Adc: 8-chx8-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 192 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 444-1001 - DEMO BOARD FOR PICMICRO MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

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M
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C is a trademark of Philips Corporation.
1997 Microchip Technology Inc.
Section 17. Master Synchronous Serial Port (MSSP)
HIGHLIGHTS
This section of the manual contains the following major topics:
17.1 Introduction ..................................................................................................................17-2
17.2 Control Register ...........................................................................................................17-4
17.3 SPI Mode .....................................................................................................................17-9
17.4 SSP I
17.5 Connection Considerations for I
17.6 Initialization ................................................................................................................17-57
17.7 Design Tips ................................................................................................................17-58
17.8 Related Application Notes..........................................................................................17-59
17.9 Revision History .........................................................................................................17-60
Note:
At present NO Mid-Range MCU devices are available with this module. Devices are
planned, but there is no schedule for availability. Please refer to Microchip’s Web site
or BBS for release of Product Briefs. You will be able to find out the details and the
features for new devices.
This module is available on Microchip’s High End family (PIC17CXXX). Please
refer to Microchip’s Web site, BBS, Regional Sales Office, or Factory Repre-
sentatives.
2
C™ Operation .................................................................................................17-18
Preliminary
2
C Bus .....................................................................17-56
DS31017A page 17-1
17