MC9S12XEP100CAG Freescale Semiconductor, MC9S12XEP100CAG Datasheet - Page 1151

• Manufacturer Part Number: MC9S12XEP100CAG
• Description: IC MCU 16BIT 1M FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEP100CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 64 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 24-ch x 12-bit
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Package: 144LQFP
• Family Name: HCS12X
• Maximum Speed: 50 MHz
• Operating Supply Voltage: 1.8|2.8|5 V
• For Use With: EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The Full Partition D-Flash command (see
information register fields where address 0x12_0000 defines the D-Flash partition for user access and
address 0x12_0004 defines the buffer RAM partition for EEE operations.
Freescale Semiconductor
Buffer RAM START = 0x13_F000
Buffer RAM END = 0x13_FFFF
D-Flash START = 0x10_0000
D-Flash END = 0x10_7FFF
MC9S12XE-Family Reference Manual , Rev. 1.23
Figure 29-3. EEE Resource Memory Map
0x13_FEC0
0x13_FFC0
0x12_FFFF
0x13_FE00
0x13_FE40
0x13_FE80
0x12_E000
0x13_FF00
0x13_FF40
0x13_FF80
0x12_0000
0x12_1000
0x12_2000
0x12_4000
Section
29.4.2.15) is used to program the EEE nonvolatile
Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2)
EEE Nonvolatile Information Register (EEEIFRON)
128 bytes
EEE Tag RAM (TMGRAMON)
256 bytes
Memory Controller Scratch RAM (TMGRAMON)
1024 bytes
D-Flash User Partition
D-Flash EEE Partition
D-Flash Memory
32 Kbytes
Buffer RAM User Partition
Buffer RAM EEE Partition
Protectable Region (EEE only)
64, 128, 192, 256, 320, 384, 448, 512 bytes
Buffer RAM
4 Kbytes
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