MC9S12XEP100CAG Freescale Semiconductor, MC9S12XEP100CAG Datasheet - Page 586

• Manufacturer Part Number: MC9S12XEP100CAG
• Description: IC MCU 16BIT 1M FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEP100CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 64 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 24-ch x 12-bit
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Package: 144LQFP
• Family Name: HCS12X
• Maximum Speed: 50 MHz
• Operating Supply Voltage: 1.8|2.8|5 V
• For Use With: EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 15 Inter-Integrated Circuit (IICV3) Block Description
The equation used to generate the divider values from the IBFD bits is:
The SDA hold delay is equal to the CPU clock period multiplied by the SDA Hold value shown in
Table
The equation for SCL Hold values to generate the start and stop conditions from the IBFD bits is:
586
MUL=1
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
SCL
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
SDA
15-7. The equation used to generate the SDA Hold value from the IBFD bits is:
SCL Divider = MUL x {2 x (scl2tap + [(SCL_Tap -1) x tap2tap] + 2)}
SDA Hold = MUL x {scl2tap + [(SDA_Tap - 1) x tap2tap] + 3}
SCL Hold(start) = MUL x [scl2start + (SCL_Tap - 1) x tap2tap]
SCL Hold(stop) = MUL x [scl2stop + (SCL_Tap - 1) x tap2tap]
IBC[7:0]
(hex)
00
01
02
03
04
05
A master SCL divider period can be prolonged at higher internal bus
frequencies. This happens when the internal bus cycle length becomes equal
to a pad delay. The SCL input is used for clock arbitration of multiple
masters. Thus after each SCL edge is internally driven an extra bus period
is counted before the pad level is attained, allowing the next toggle. This has
the effect of extending the SCL Divider values in
and IBC[7:0] = 0x00 to 0x0F.
START condition
Table 15-7. IIC Divider and Hold Values (Sheet 1 of 6)
SCL Divider
(clocks)
MC9S12XE-Family Reference Manual , Rev. 1.23
20
22
24
26
28
30
Figure 15-5. SCL Divider and SDA Hold
SCL Hold(start)
NOTE
SDA Hold
(clocks)
7
7
8
8
9
9
Table 15-7
STOP condition
SCL Hold
(start)
10
11
6
7
8
9
for MUL=1
Freescale Semiconductor
SCL Hold(stop)
SCL Hold
(stop)
11
12
13
14
15
16